A wafer inspection system is provided. The wafer inspection system comprises: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

An auxiliary device for functional expansion and signal acquisition of a testing system is provided with a pogo pin attaching device including at least one spiral spring loop, at least one fastening member, and at least one cable. The fastening member includes at least one limiting hole and at least one fastening hole. The spiral spring loop is disposed in the limiting hole. The cable passes through the fastening hole to electrically connect to the spiral spring loop.

A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section/

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

A test system (10) for testing an electric device (30), in particular a high-voltage device, has a portable main device (100) with a housing (140), an electric connection assembly (120, 121) and a mechanical connection assembly (145) and has a portable additional device (200, 300) with a separate housing (240, 340), an electric connection assembly (220, 320) and a mechanical connection assembly (245). The main device (100) can be mechanically connected to the additional device (200, 300) in a releasable manner by coupling the mechanical connection assemblies (145, 245) to form a structural unit, wherein the main device (100) can be electrically connected to the additional device (200, 300) via the first electric connection assemblies (120, 121, 220, 320).

A test system (10) for testing an electric device (30), in particular a high-voltage device, has a portable main device (100) with a housing (140), an electric connection assembly (120, 121) and a mechanical connection assembly (145) and has a portable additional device (200, 300) with a separate housing (240, 340), an electric connection assembly (220, 320) and a mechanical connection assembly (245). The main device (100) can be mechanically connected to the additional device (200, 300) in a releasable manner by coupling the mechanical connection assemblies (145, 245) to form a structural unit, wherein the main device (100) can be electrically connected to the additional device (200, 300) via the first electric connection assemblies (120, 121, 220, 320).

Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.