A sensor cable harness for coupling one or more sensors to at least one electrical asset of a power grid, comprises at least one sensor to sense a condition of the at least one electrical asset. At least one signal cable is configured to carry a sensor data signal from the at least one sensor to an electrical analytics unit (EAU). An asset indicator device is provided to at least temporarily couple to the at least one signal cable to indicate the at least one electrical asset being sensed by an assigned port of the EAU.

A method for assembling an ultrahigh-frequency spring probe test assembly includes: drilling signal cavities, power supply cavities, and grounding cavities, assembling an upper mold core and a lower mold core and performing curing, mounting an upper shaft sleeve and a lower shaft sleeve, inserting a signal probe, a power supply probe and a grounding probe, and mounting an upper base to complete assembling the probe test assembly. The signal probe becomes coaxial with the signal cavity by mounting the insulating ring, achieving small signal loss; the insulating mold core is inserted into the power supply cavity after drilling and is bonded to the power supply cavity via adhesive to form a dual-layer insulating structure between the power supply probe and the base, having high insulation performance and low power loss; the grounding probe is in direct contact with the metal base, achieving high conductivity.

A plurality of test pads are formed on a first substrate or a second substrate. A plurality of first solder joints are reserved on a first surface of the first substrate, and each of the first solder joints is coupled to at least a test pad or to another first solder joint through at least a first trace. A plurality of second solder joints are reserved on a second surface of the second substrate. Each of the second solder joints is coupled to at least a test pad or to another second solder joint through at least a second trace. A plurality of dummy solder balls are formed between the first solder joints and the second solder joints. Probes are coupled to the test pads to measure circuit characteristics between the test pads.

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.

Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.

A measuring assembly for measuring a temperature and a voltage includes a contact element including a temperature sensor and an electrically conductive portion, a voltage measurement conductor electrically connected to the conductive portion of the contact element, and an electrically conductive fixation element electrically connected to the conductive portion of the contact element, the electrically conductive fixation element extending through a fixation hole of a busbar in a fixed state to connect to the busbar by an elastic force provided by the electrically conductive fixation element in the fixed state, and the electrically conductive fixation element pressing the contact element to a measuring surface of the busbar by the elastic force in the fixed state.

A system and method for detecting dynamic electromagnetic emission of an integrated circuit (IC) chip is provided. One embodiment of the method, includes exciting nitro vacancy (NV) centers of a diamond slide located in close proximity to the IC chip via use of light, resulting in an NV fluorescence; providing an optical readout of the NV fluorescence, wherein the optical readout provides quantum states of the NV centers, thereby providing a spectra of electromagnetic fields of the IC chip. A determination is then made of at least one of the group comprising clock frequencies of the IC chip, referred to herein as determined clock frequencies, and data bandwidth of the IC chip, referred to herein as determined data bandwidth of the IC chip, from the spectra of electromagnetic fields of the IC chip. A comparison is then performed, comparing at least one of the group comprising determined clock frequencies and determined data bandwidth, to at least one of the group comprising expected clock frequencies of the IC chip and expected data bandwidth of the IC chip, thereby determining if a foreign device or software is located on the IC chip.

A system and method for detecting dynamic electromagnetic emission of an integrated circuit (IC) chip is provided. One embodiment of the method, includes exciting nitro vacancy (NV) centers of a diamond slide located in close proximity to the IC chip via use of light, resulting in an NV fluorescence; providing an optical readout of the NV fluorescence, wherein the optical readout provides quantum states of the NV centers, thereby providing a spectra of electromagnetic fields of the IC chip. A determination is then made of at least one of the group comprising clock frequencies of the IC chip, referred to herein as determined clock frequencies, and data bandwidth of the IC chip, referred to herein as determined data bandwidth of the IC chip, from the spectra of electromagnetic fields of the IC chip. A comparison is then performed, comparing at least one of the group comprising determined clock frequencies and determined data bandwidth, to at least one of the group comprising expected clock frequencies of the IC chip and expected data bandwidth of the IC chip, thereby determining if a foreign device or software is located on the IC chip.

A method for manufacturing a wire harness includes: disposing a trunk harness, a branch harness and control boxes on a workbench and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.

A method for manufacturing a wire harness includes: disposing a trunk harness, a branch harness and control boxes on a workbench and attaching the trunk harness and the branch harness to the control boxes; connecting the control boxes to an external device via the branch harness; and switching operation mode of at least one of the control boxes to an information writing mode for inputting information for operating the electric component to be connected to the branch harness into the at least one of the control boxes and then inputting the information from the external device into the at least one of the control boxes via the branch harness.