Provided is a jig enabling detachment and attachment of a probe head from and to an electric connecting apparatus without using a special holding device. A jig (50) is applied to an electric connecting apparatus (10) electrically connecting a device under test to a testing apparatus for the device under test. The electric connecting apparatus includes a wiring substrate (22) and a probe head (28) secured to the wiring substrate with a plurality of set screws (26) and including a plurality of probes (34) made of a magnetic body. The jig (50) includes a plate (52) and a magnet (54) attached to the plate. The plate can detachably be attached to the probe head, and the magnet is opposed to a lower end portion (34 b) of each of the probes.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

A novel coupling system may include a head-end circuit for coupling a probe via a cable to an instrument, delivering power to the probe over the cable while the cable carries signal(s) from the probe to the instrument. The head-end circuit may include a first terminal for coupling to the probe via a cable, and may further include a second terminal for coupling to the instrument. The head-end circuit may apply direct-current (DC) power to the cable, and may remove a DC voltage offset resulting from the applied DC power before a signal from the probe reaches the instrument. The head-end circuit may include a common node coupled to the first terminal, a current source coupling the common node to a supply voltage, and a voltage source coupling the common node to a second terminal that couples to the instrument.

An inspection jig may include: an electrode; a probe, the probe having a rear end portion and a tip portion to contact a bump; and a support member supporting the probe. The probe may include: an outer tubular body that is electrically conductive; and an inner tubular body that is electrically conductive, the inner tubular body being inserted into the outer tubular body. The outer tubular body may include outer spring parts to bias the rear end portion. The inner tubular body may include inner spring parts. The tip portion may be a first end of the inner tubular body, and protrudes from a first end of the outer tubular body. The support member may hold the outer tubular body such that the rear end portion is brought into contact with the electrode by the biasing force of the outer spring parts.

An inspection jig may include: an electrode; a probe, the probe having a rear end portion and a tip portion to contact a bump; and a support member supporting the probe. The probe may include: an outer tubular body that is electrically conductive; and an inner tubular body that is electrically conductive, the inner tubular body being inserted into the outer tubular body. The outer tubular body may include outer spring parts to bias the rear end portion. The inner tubular body may include inner spring parts. The tip portion may be a first end of the inner tubular body, and protrudes from a first end of the outer tubular body. The support member may hold the outer tubular body such that the rear end portion is brought into contact with the electrode by the biasing force of the outer spring parts.

A test system for testing a wafer for integrated circuit devices is described. The test system comprises a first plurality of test probes adapted to make electrical contacts to first corresponding contacts of a wafer tested by the test system; a second plurality of test probes adapted to make electrical contacts to second corresponding contacts on a perimeter region of a portion of the wafer tested by the test system; and a control circuit coupled to the first plurality of test probes and the second plurality of test probes; wherein the control circuit determines whether the second plurality of test probes has a proper contact with the wafer based upon signals received by the second plurality of test probes. A method of testing a wafer for an integrated circuit is also described.

The disclosure relates to a cable, which is adapted to extend in an initial configuration according to a predetermined initial state and in a deformed configuration to assume a deformed state compared with the initial state, wherein the cable has a sheath arrangement, which extends along a longitudinal axis of the cable at least in sections, wherein the sheath arrangement is adapted to change its impedance according to the initial or deformed configuration of the cable. The disclosure likewise relates to an arrangement comprising a cable and a measuring unit as well as a method for detecting a deformed configuration of a cable.

A testing apparatus includes a holster including a jack defining a conductive periphery configured to connect with a reference lead of the voltage probe to form a common ground. The apparatus includes a shunt defining first and second regions of different potential having predetermined difference. The second region is configured to connect with a reference lead of the shunt probe. The apparatus includes a bridge configured to connect the shunt probe lead with the common ground.

A testing apparatus includes a holster including a jack defining a conductive periphery configured to connect with a reference lead of the voltage probe to form a common ground. The apparatus includes a shunt defining first and second regions of different potential having predetermined difference. The second region is configured to connect with a reference lead of the shunt probe. The apparatus includes a bridge configured to connect the shunt probe lead with the common ground.

Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected. An inspection signal supplied from an inspection device to the probes 3 is set as an alternating current signal, and the probe card 1 causes capacitive coupling between the needle tip parts 13 and the electrode of the object to be inspected, and transmits the inspection signal.