G01R1/18

Test probe assembly and test socket

A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

Test probe assembly and test socket

A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

SHIELD BOX, SHIELD BOX ASSEMBLY AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE
20170359925 · 2017-12-14 ·

A shield box includes a top portion, a bottom portion and a socket. The top portion defines an aperture and includes at least one first ridge and at least one first groove. The bottom portion includes at least one second ridge and at least one second groove. The first ridge of the top portion occupies a second space defined by the second groove of the bottom portion, and the second ridge of the bottom portion occupies a first space defined by the first groove of the top portion. The socket is disposed over the bottom portion and accessible through the aperture of the top portion.

SHIELD BOX, SHIELD BOX ASSEMBLY AND APPARATUS FOR TESTING A SEMICONDUCTOR DEVICE
20170359925 · 2017-12-14 ·

A shield box includes a top portion, a bottom portion and a socket. The top portion defines an aperture and includes at least one first ridge and at least one first groove. The bottom portion includes at least one second ridge and at least one second groove. The first ridge of the top portion occupies a second space defined by the second groove of the bottom portion, and the second ridge of the bottom portion occupies a first space defined by the first groove of the top portion. The socket is disposed over the bottom portion and accessible through the aperture of the top portion.

Encapsulated printed circuit board assembly

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

Encapsulated printed circuit board assembly

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

Device for compensating electromagnetic interferences during biomagnetic measurements

Invention, relates to the field of supersensitive biomagnetometry under presence of external electromagnetic interferences. In order to perform passive compensation of said interferences, design of device at the magnetometer input is proposed, comprising compensation elements and means for their moving including shifting, holding, and fixation units. In the basic embodiment, three short-closed wire contours are used which are orthogonally placed in space and independently moved up-down relative to the magnetometer or its input antenna. Contours are fixed in positions where minimum of external interference amplitude is achieved according to given field projection. Variants are proposed with cooling of meter and/or contours, location of contours inside the cryostat and their manufacturing from superconductors.

Device for compensating electromagnetic interferences during biomagnetic measurements

Invention, relates to the field of supersensitive biomagnetometry under presence of external electromagnetic interferences. In order to perform passive compensation of said interferences, design of device at the magnetometer input is proposed, comprising compensation elements and means for their moving including shifting, holding, and fixation units. In the basic embodiment, three short-closed wire contours are used which are orthogonally placed in space and independently moved up-down relative to the magnetometer or its input antenna. Contours are fixed in positions where minimum of external interference amplitude is achieved according to given field projection. Variants are proposed with cooling of meter and/or contours, location of contours inside the cryostat and their manufacturing from superconductors.

Browser probe
09797927 · 2017-10-24 · ·

A browser probe has a probe body including a signal line, a nose of electrical insulating material integral with and projecting from the probe body, a pin supported by the probe body and electrically conductively connected to the signal line, a spring exerting a biasing force on the pin, an electrically conductive probe tip supported by the nose at a distal end of the nose remote from the probe body, and a plurality of discrete resistors interposed between the pin and the probe tip within the nose. The resistors are supported independently of another so as to be slidable within the nose. The probe tip is electrically conductively connected to the signal line via the resistors and the pin under the biasing force exerted by the spring.

Apparatus and method for indirectly cooling superconducting quantum interference device

An apparatus and a method for indirectly cooling a superconducting quantum interference device (SQUID) are provided. The apparatus includes an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar.