G01R1/24

Methods and devices for real-time monitoring of tunable filters

Methods and devices suitable for monitoring the frequency of microwave tunable filters in real time. The frequency readout relies on the natural response of such a filter when excited by a pulse. Methods of measuring an operating frequency of a pole in a tunable filter include measuring a number of cycles in a natural response in the filter when the filter is excited by an electric current pulse, and determining a resonance frequency based on the number of cycles measured in the natural response. Such a method can provide the operating frequency information in a binary digital format, making it relatively easy to read and process. A measuring resonator may be mounted to the filter resonator and connected by a common actuator.

STANDARD RECTANGULAR WAVEGUIDE WITH RF PORT INPUT TRANSITION
20240319244 · 2024-09-26 ·

Disclosed herein is a waveguide with an RF port input transition. The waveguide includes: a tubular rectangular body having openings formed at opposite sides thereof, each of the openings having a flange therearound; multiple isolator ports formed at predetermined intervals in one wall of the rectangular body, the isolator ports each being switchable between open and closed states; multiple impedance matching ports formed at predetermined intervals in another wall of the rectangular body opposite the one wall, the impedance matching ports each being switchable between open and closed states; and a radiator port formed at a center of the one wall of the rectangular body.

Waveguides for capturing close-proximity electromagnetic radiation transmitted by wireless chips during testing on automated test equipment (ATE)

A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

Waveguides for capturing close-proximity electromagnetic radiation transmitted by wireless chips during testing on automated test equipment (ATE)

A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

WAVEGUIDES FOR CAPTURING CLOSE-PROXIMITY ELECTROMAGNETIC RADIATION TRANSMITTED BY WIRELESS CHIPS DURING TESTING ON AUTOMATED TEST EQUIPMENT (ATE)

A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

WAVEGUIDES FOR CAPTURING CLOSE-PROXIMITY ELECTROMAGNETIC RADIATION TRANSMITTED BY WIRELESS CHIPS DURING TESTING ON AUTOMATED TEST EQUIPMENT (ATE)

A test fixture has a flexible plastic cable that acts as a waveguide. The Device-Under-Test (DUT) is a small transceiver and antenna that operate in the Extremely High-Frequency (EHF) band of 30-300 GHz. The size of the DUT transceiver is very small, limiting the power of emitted electromagnetic radiation so that close-proximity communication is used. The envelope for reception may only extend for about a centimeter from the DUT transceiver, about the same size as the test socket. A slot is formed in the test socket very near to the antenna. The slot receives one end of the plastic waveguide. The slot extends into the envelope by the DUT transceiver so that close-proximity radiation is captured by the plastic waveguide. The waveguide has a high relative permittivity and reflective metalized walls so that the radiation may be carried to a receiver that is outside the envelope.

METHOD AND APPARATUS FOR SOCKET POWER CALIBRATION WITH FLEXIBLE PRINTED CIRCUIT BOARD
20180003736 · 2018-01-04 ·

A structure for performing socket power calibration is disclosed. The structure comprises a plurality of socket ports on a load board electrically coupled to a plurality of traces on a first end of a flexible printed circuit board, wherein the plurality of traces are configured to allow traversal of an electrical signal from the plurality of socket ports to a waveguide. The structure further comprises the plurality of traces, wherein the traces are operable to terminate on a second end of the flexible printed circuit board into a plurality of patch antennas, wherein the plurality of patch antennas is adapted to radiate the electrical signal into the waveguide. Finally, the structure also comprises a power sensor electrically coupled to the waveguide, wherein the waveguide is configured to communicate the electrical signal from the waveguide to the power sensor.

METHOD AND APPARATUS FOR SOCKET POWER CALIBRATION WITH FLEXIBLE PRINTED CIRCUIT BOARD
20180003736 · 2018-01-04 ·

A structure for performing socket power calibration is disclosed. The structure comprises a plurality of socket ports on a load board electrically coupled to a plurality of traces on a first end of a flexible printed circuit board, wherein the plurality of traces are configured to allow traversal of an electrical signal from the plurality of socket ports to a waveguide. The structure further comprises the plurality of traces, wherein the traces are operable to terminate on a second end of the flexible printed circuit board into a plurality of patch antennas, wherein the plurality of patch antennas is adapted to radiate the electrical signal into the waveguide. Finally, the structure also comprises a power sensor electrically coupled to the waveguide, wherein the waveguide is configured to communicate the electrical signal from the waveguide to the power sensor.

Intelligent wafer-level testing of photonic devices

A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.

Intelligent wafer-level testing of photonic devices

A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.