Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

A method and a circuit arrangement for testing and/or calibration, the circuit arrangement having a sensor electrode and a first and second circuit unit coupled thereto, the second circuit unit having a capacitor, and the sensor electrode being kept at a specified electrical target potential by the capacitor and the sensor electrode being coupled such that matching of the electrical potential is made possible. The second circuit unit is configured such that, if the electrical potential of the capacitor is outside a reference range, second circuit unit detects this event and brings the capacitor to a reference potential. For the purpose of testing and/or calibration, a reference current source is provided for injecting an adjustable reference current into the sensor electrode, a reference current injected into another circuit unit is measured, and/or a reference current is injected into different portions of the sensor electrode.

A method and a circuit arrangement for testing and/or calibration, the circuit arrangement having a sensor electrode and a first and second circuit unit coupled thereto, the second circuit unit having a capacitor, and the sensor electrode being kept at a specified electrical target potential by the capacitor and the sensor electrode being coupled such that matching of the electrical potential is made possible. The second circuit unit is configured such that, if the electrical potential of the capacitor is outside a reference range, second circuit unit detects this event and brings the capacitor to a reference potential. For the purpose of testing and/or calibration, a reference current source is provided for injecting an adjustable reference current into the sensor electrode, a reference current injected into another circuit unit is measured, and/or a reference current is injected into different portions of the sensor electrode.

Detection and protection against electric power generator rotor turn-to-turn faults, rotor multi-point-to-ground faults, and rotor permanent magnet faults is provided herein. A fractional harmonic signal is used to determine the rotor fault condition. The fractional harmonic signal may be a fractional harmonic magnitude of the circulating current of one phase. The fractional harmonic may be a fractional harmonic magnitude of a neutral voltage. A tripping subsystem may issue a trip command based upon detection of a rotor turn-to-turn fault condition.

Detection and protection against electric power generator rotor turn-to-turn faults, rotor multi-point-to-ground faults, and rotor permanent magnet faults is provided herein. A fractional harmonic signal is used to determine the rotor fault condition. The fractional harmonic signal may be a fractional harmonic magnitude of the circulating current of one phase. The fractional harmonic may be a fractional harmonic magnitude of a neutral voltage. A tripping subsystem may issue a trip command based upon detection of a rotor turn-to-turn fault condition.

An electronic circuit according to an embodiment includes a clock generator, a delay element, a first electromagnetic coupler, a first frequency converter, a second electromagnetic coupler, a second frequency converter, a controller and an output device. The clock generator is configured to generate a first clock signal. The delay element is configured to output a second clock signal which has a phase delayed with respect to the first clock signal. The first electromagnetic coupler is configured to transmit one of the first and second clock signals by electromagnetic coupling. The first frequency converter is driven by the one of the first and second clock signals transmitted from the first electromagnetic coupler and is configured to convert a first input signal to a first signal with a first frequency corresponding to the one of the first and second clock signals.

An electronic circuit according to an embodiment includes a clock generator, a delay element, a first electromagnetic coupler, a first frequency converter, a second electromagnetic coupler, a second frequency converter, a controller and an output device. The clock generator is configured to generate a first clock signal. The delay element is configured to output a second clock signal which has a phase delayed with respect to the first clock signal. The first electromagnetic coupler is configured to transmit one of the first and second clock signals by electromagnetic coupling. The first frequency converter is driven by the one of the first and second clock signals transmitted from the first electromagnetic coupler and is configured to convert a first input signal to a first signal with a first frequency corresponding to the one of the first and second clock signals.

Embodiments of the invention are directed to a current sensor that includes a current controlled oscillator circuit configured to receive an input current and to provide an output signal having an output frequency which is dependent on the input current. The current sensor further includes a feedforward circuit configured to adapt a reference voltage of the current controlled oscillator in dependence on an instantaneous current value of the input current.

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.