An in-memory computing (IMC) memory device and an IMC method are provided. The IMC memory device includes: a plurality of memory cells, the memory cells forming a plurality of computing layers; and a plurality of computing layer connectors, the computing layer connectors connecting between the computing layers. A first computing layer input is inputted into a first computing layer of the computing layers. The first computing layer generates a first computing layer output. A first computing layer connector of the computing layer connectors converts the first computing layer output into a second computing layer input. The first computing layer connector inputs the second computing layer input into a second computing layer of the computing layers. The computing layer connectors are a plurality of inverters, a plurality of voltage-to-voltage converters or a plurality of current-to-voltage converters.

An in-memory computing (IMC) memory device and an IMC method are provided. The IMC memory device includes: a plurality of memory cells, the memory cells forming a plurality of computing layers; and a plurality of computing layer connectors, the computing layer connectors connecting between the computing layers. A first computing layer input is inputted into a first computing layer of the computing layers. The first computing layer generates a first computing layer output. A first computing layer connector of the computing layer connectors converts the first computing layer output into a second computing layer input. The first computing layer connector inputs the second computing layer input into a second computing layer of the computing layers. The computing layer connectors are a plurality of inverters, a plurality of voltage-to-voltage converters or a plurality of current-to-voltage converters.

In a control apparatus including a drive unit, first and second power supplies, a first diode, first and second control units, and a control method of the control apparatus, the first diode is connected to first and second power lines such that a direction from the second power line to the first power line is set as a forward direction, the second control unit is configured to calculate correction information for a first state value based on the voltage of the first power line before and after an abnormality has occurred in the first power supply and to transmit the correction information to the first control unit when the abnormality has occurred in the first power supply, and the first control unit is configured to correct the first state value using the correction information when the correction information has been received from the second control unit.

In a control apparatus including a drive unit, first and second power supplies, a first diode, first and second control units, and a control method of the control apparatus, the first diode is connected to first and second power lines such that a direction from the second power line to the first power line is set as a forward direction, the second control unit is configured to calculate correction information for a first state value based on the voltage of the first power line before and after an abnormality has occurred in the first power supply and to transmit the correction information to the first control unit when the abnormality has occurred in the first power supply, and the first control unit is configured to correct the first state value using the correction information when the correction information has been received from the second control unit.

A voltage sensing circuit for a switching power converter includes a comparator having a comparator input stage that processes a voltage from a main DAC and a current from a tracking DAC.

A voltage sensing circuit for a switching power converter includes a comparator having a comparator input stage that processes a voltage from a main DAC and a current from a tracking DAC.

A failure determination circuit includes a first A/D conversion circuit that continuously A/D converts a first analog signal based on a first physical quantity measurement signal, a switching circuit that receives a plurality of signals including a second analog signal based on the first physical quantity measurement signal and a first reference voltage and outputs the plurality of signals in a time division manner, a second A/D conversion circuit that A/D converts the output of the switching circuit, and a determination circuit, and the determination circuit determines a failure of the first A/D conversion circuit using a signal based on a first digital signal obtained by A/D converting the first analog signal by the first A/D conversion circuit and a signal based on a second digital signal obtained by A/D converting the second analog signal by the second A/D conversion circuit.

One example relates to a monitoring circuit that includes a capacitive digital-to-analog converter that receives a binary code, a reference voltage, a monitored voltage, and a ground reference, the capacitive digital-to-analog converter outputting an analog signal based on the binary code, the reference voltage, the monitored voltage, and the ground reference. The monitoring circuit further includes a comparator including a first input coupled to receive the analog signal and a second input coupled to the reference voltage, the comparator comparing the analog signal to the reference voltage and outputting a comparator signal based on the comparison. The monitoring circuit yet further includes a binary code generator that generates the binary code based on the comparator signal, the binary code approximating a magnitude of the monitored voltage.

One example relates to a monitoring circuit that includes a capacitive digital-to-analog converter that receives a binary code, a reference voltage, a monitored voltage, and a ground reference, the capacitive digital-to-analog converter outputting an analog signal based on the binary code, the reference voltage, the monitored voltage, and the ground reference. The monitoring circuit further includes a comparator including a first input coupled to receive the analog signal and a second input coupled to the reference voltage, the comparator comparing the analog signal to the reference voltage and outputting a comparator signal based on the comparison. The monitoring circuit yet further includes a binary code generator that generates the binary code based on the comparator signal, the binary code approximating a magnitude of the monitored voltage.

According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.