An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.

An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.

The present invention provides an over the air, OTA, power sensor (1, 20, 50) for measuring power of a wireless signal (2, 21) with at least two different polarizations, the OTA power sensor (1, 20, 50) comprising a first power sensor (3, 4, 22, 23, 51, 52) for every polarization, every power sensor comprising a signal detector (5, 6, 25, 26, 27) for detecting the wireless signal (2, 21), wherein the signal detectors (5, 6, 25, 26, 27) are single polarized and wherein the polarization planes (7, 8, 28-30) of the signal detectors (5, 6, 25, 26, 27) are arranged at an angle of more than zero degree to each other and wherein the main radiation vectors (9, 10, 31-33) of the signal detectors (5, 6, 25, 26, 27) are parallel to each other, and the first power sensors (3, 4, 22, 23, 51, 52) each comprising a power measurement device (11, 12, 43-45), which is configured to measure the power of the detected wireless signal (2, 21) and output a respective measurement signal (13, 14, 46-48, 55-58). Further, the present patent application provides a respective method.

A device includes an output circuit that includes an input port at which a signal is received, an output port at which an impedance-adjusted representation of the signal is provided, and a set of bond wires connecting the input and output ports. The device further includes first and second couplers, each including a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires. The first coupler is oriented relative to the distributed-element output circuit to measure forward power provided by the impedance-adjusted representation of the signal via the output port. The second coupler is oriented relative to the output circuit to measure reflected power received via the output port.

A device includes an output circuit that includes an input port at which a signal is received, an output port at which an impedance-adjusted representation of the signal is provided, and a set of bond wires connecting the input and output ports. The device further includes first and second couplers, each including a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires. The first coupler is oriented relative to the distributed-element output circuit to measure forward power provided by the impedance-adjusted representation of the signal via the output port. The second coupler is oriented relative to the output circuit to measure reflected power received via the output port.

A method of detecting a relatively weak signal includes providing an oscillatory loop that can sustain oscillations, wherein the oscillatory loop has no more than one or an even-number of stages. The loop includes a first weakly bistable differential amplifier and a second weakly bistable differential amplifier. At least one of the first and second weakly bistable differential amplifiers is connected to a behavior perturbing coupling which is operative to introduce into the connected-to amplifier a behavior tipping signal where, even if the behavior tipping signal is much weaker than an oscillation of the one or multistage oscillatory loop, the relatively weak behavior tipping signal can nonetheless alter the oscillatory behavior of the multistage oscillatory loop in a distinguishable way. The system may be used for detecting outside a patient's body weak manifestations of internal nerve firings.

A method of detecting a relatively weak signal includes providing an oscillatory loop that can sustain oscillations, wherein the oscillatory loop has no more than one or an even-number of stages. The loop includes a first weakly bistable differential amplifier and a second weakly bistable differential amplifier. At least one of the first and second weakly bistable differential amplifiers is connected to a behavior perturbing coupling which is operative to introduce into the connected-to amplifier a behavior tipping signal where, even if the behavior tipping signal is much weaker than an oscillation of the one or multistage oscillatory loop, the relatively weak behavior tipping signal can nonetheless alter the oscillatory behavior of the multistage oscillatory loop in a distinguishable way. The system may be used for detecting outside a patient's body weak manifestations of internal nerve firings.

An integrated circuit (IC) is provided with a plurality of diode based mm-wave peak voltage detectors (PVD)s. During a testing phase, a multi-point low frequency calibration test is performed on one or more of the PVDs to determine and store a set of alternating current (AC) coefficients. During operation of the IC, a current-voltage sweep is performed on a selected one of the PVDs to determine a process and temperature direct current (DC) coefficient. A peak voltage produced by the PVD in response to a high frequency radio frequency (RF) signal is measured to produce a first measured voltage. An approximate power of the RF signal is calculated by adjusting the first measured voltage using the DC coefficient and the AC coefficient.

An integrated circuit (IC) is provided with a plurality of diode based mm-wave peak voltage detectors (PVD)s. During a testing phase, a multi-point low frequency calibration test is performed on one or more of the PVDs to determine and store a set of alternating current (AC) coefficients. During operation of the IC, a current-voltage sweep is performed on a selected one of the PVDs to determine a process and temperature direct current (DC) coefficient. A peak voltage produced by the PVD in response to a high frequency radio frequency (RF) signal is measured to produce a first measured voltage. An approximate power of the RF signal is calculated by adjusting the first measured voltage using the DC coefficient and the AC coefficient.

An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.