The present disclosure generally relates to sensor device, such as a magnetic sensor bridge, that utilizes a dual free layer (DFL) structure. The device includes a plurality of resistors that each includes the same DFL structure. Adjacent the DFL structure is a magnetic structure that can include a permanent magnet, an antiferromagnetic (AFM) layer having a synthetic AFM (SAF) structure thereon, a permanent magnetic having a SAF structure thereon, or an AFM layer having a ferromagnetic layer thereon. The DFL structures are aligned with different layers of the magnetic structures to differentiate the resistors. The different alignment and/or different magnetic structures result in a decrease in production time due to reduced complexity and, thus, reduces costs.

The present disclosure generally relates to sensor device, such as a magnetic sensor bridge, that utilizes a dual free layer (DFL) structure. The device includes a plurality of resistors that each includes the same DFL structure. Adjacent the DFL structure is a magnetic structure that can include a permanent magnet, an antiferromagnetic (AFM) layer having a synthetic AFM (SAF) structure thereon, a permanent magnetic having a SAF structure thereon, or an AFM layer having a ferromagnetic layer thereon. The DFL structures are aligned with different layers of the magnetic structures to differentiate the resistors. The different alignment and/or different magnetic structures result in a decrease in production time due to reduced complexity and, thus, reduces costs.

The present invention discloses an AC impedance measurement circuit with a calibration function, which is characterized in that only one calibration impedance is needed, associated with a switch circuit. Based on the measurement results of the two calibration modes, an equivalent impedance of the switch circuit, circuit gain and phase offset can be calculated. Based on the above results, the equivalent impedance of the internal circuit is deducted from the measurement result of the measurement mode to accurately calculate an AC conductance and a phase of the AC conductance for impedance to be measured. In addition, by adjusting a phase difference between an input sine wave signal and a sampling clock signal, impedance of the same phase and impedance of the quadrature phase can be obtained, respectively, and the AC impedance and phase angle of the impedance to be measured can be calculated.

A method for determining system resistance of at least one power supply of a handheld medical device, the method including: a) generating at least one excitation voltage signal, wherein the excitation voltage signal comprises at least one direct current (DC) voltage signal, wherein the excitation voltage signal has a fast transition DC flank of 20 ns or less; b) applying the excitation voltage signal to at least one reference resistor having a predetermined or pre-defined resistance value, wherein the reference resistor is arranged in series with the power supply; c) measuring a response signal of the power supply; d) determining a signal flank from the response signal and determining an ohmic signal portion from one or both of shape and height of the signal flank; and e) determining the system resistance of the power supply from the ohmic signal portion.

A method for determining system resistance of at least one power supply of a handheld medical device, the method including: a) generating at least one excitation voltage signal, wherein the excitation voltage signal comprises at least one direct current (DC) voltage signal, wherein the excitation voltage signal has a fast transition DC flank of 20 ns or less; b) applying the excitation voltage signal to at least one reference resistor having a predetermined or pre-defined resistance value, wherein the reference resistor is arranged in series with the power supply; c) measuring a response signal of the power supply; d) determining a signal flank from the response signal and determining an ohmic signal portion from one or both of shape and height of the signal flank; and e) determining the system resistance of the power supply from the ohmic signal portion.

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

A current sensor including a measurement circuit and an electrical conductor having at least one first measurement path defined by a first pickup contact and a second pick-up contact at which a first voltage can be detected across the first measurement path, a first connection contact for electrically contacting a connection element, a second connection contact for electrically contacting a battery pole terminal, and a current feed contact for electrically contacting a device for providing a calibration current. The first measurement path is in series between the first connection contact and the second connection contact. A calibration current supplied at the current feed contact induces a current density distribution in the first measurement path, which converges with a current density distribution in the first measurement path, induced by a load current of equal current intensity supplied at the first connection contact.

A semiconductor device includes an analog-digital conversion circuit that converts a voltage at a node between a reference resistor and a sensor resistor into output data, the reference resistor and the sensor resistor being connected in series. The semiconductor device calculates a resistance value of the sensor resistor using a first output data obtained in a first conversion phase and second output data obtained in a second conversion phase. In the first conversion phase, a high potential side voltage is applied to one end of the reference resistor and a low potential side voltage is applied to one end of the sensor resistor. In the second conversion phase, the low potential side voltage is applied to one end of the reference resistor and the high potential side voltage is applied to one end of the sensor resistor.

A semiconductor device includes an analog-digital conversion circuit that converts a voltage at a node between a reference resistor and a sensor resistor into output data, the reference resistor and the sensor resistor being connected in series. The semiconductor device calculates a resistance value of the sensor resistor using a first output data obtained in a first conversion phase and second output data obtained in a second conversion phase. In the first conversion phase, a high potential side voltage is applied to one end of the reference resistor and a low potential side voltage is applied to one end of the sensor resistor. In the second conversion phase, the low potential side voltage is applied to one end of the reference resistor and the high potential side voltage is applied to one end of the sensor resistor.

Accurately measuring bio-impedance is important for sensing properties of the body. Unfortunately, contact impedances can significantly degrade the accuracy of bio-impedance measurements. To address this issue, circuitry for implementing a four-wire impedance measurement can be configured to make multiple current measurements. The multiple current measurements set up a system of equations to allow the unknown bio-impedance and contact impedances to be derived. The result is an accurate bio-impedance measurement that is not negatively impacted by large contact impedances. Moreover, bad contacts with undesirably large impedances can be identified.