Embodiments presented in this disclosure generally relate to a ground device. More specifically, embodiments disclosed herein are directed to a grounding device for indicating whether there is proper grounding for electrical equipment. One embodiment presented in this disclosure provides an apparatus. The apparatus generally includes a lug configured to be coupled to a physical ground node, the lug having one or more bolts for coupling the lug to a surface of a plate such that the physical ground node is electrically coupled to an electrical ground node. The apparatus also includes a sensing circuit configured to detect whether the physical ground node is electrically coupled to the electrical ground node, and provide an indication of whether the physical ground node is electrically coupled to the electrical ground node based on the detection.

A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

In an example, monitoring circuitry includes a first and a second coupling to electrically connect the monitoring circuitry to a monitored circuit having a resistance. The resistance of the monitored circuit may be indicative of a status, and the monitored circuit may be connected in series between the first and second coupling. The first coupling comprises a plurality of galvanically separated connection elements which are to form an electrical connection with a common connection element of the monitored circuit. The monitoring circuitry further comprises a monitoring apparatus to determine the resistance of the monitored circuit via the first coupling and the second coupling. The monitoring apparatus is to acquire a plurality of electrical values and to use the plurality of electrical values to determine a value of the resistance of the monitored circuit.

A contact resistance test device includes a set of full fins providing channels between a source region and a drain region and a set of partial fins connected to the source region. A gate structure is formed over the set of full fins and set of partial fins. A source contact is connected to the source region. A probe contact is isolated from the source contact and is connected to the source region wherein a voltage measured on the probe contact measures contact resistance when a drain-to-source current is flowing in the set of full fins.

A socket detection apparatus for supporting anomaly detection of an earth wire and a neutral wire includes: a micro-control unit, provided with a test plug of a fire wire connection end, a neutral wire connection end and an earth wire connection end, and a detection circuit connected with the test plug; and an induction antenna arranged corresponding to a fire wire end of a detected power socket, the induction antenna being connected with a first signal input end of the micro-control unit.

A socket detection apparatus for supporting anomaly detection of an earth wire and a neutral wire includes: a micro-control unit, provided with a test plug of a fire wire connection end, a neutral wire connection end and an earth wire connection end, and a detection circuit connected with the test plug; and an induction antenna arranged corresponding to a fire wire end of a detected power socket, the induction antenna being connected with a first signal input end of the micro-control unit.

An instrument for performing highly accurate PCR employing an assembly, a heated cover, and an internal computer, is provided. The assembly is made up of a sample block, a number of Peltier thermal electric devices, and a heat sink, clamped together. A control algorithm manipulates the current supplied to thermoelectric coolers such that the dynamic thermal performance of a block can be controlled so that pre-defined thermal profiles of sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block/heat sink assembly can be changed to another of the same or different design. The assembly carries the necessary information required to characterize its own performance in an on-board memory device, allowing the assembly to be interchangeable among instruments while retaining its precision operating characteristics.

Provided is a method and device for obtaining internal side and external side insulation resistances of a relay. The method includes: controlling an insulation resistance obtaining circuit to output an AC signal; when both a main relay and a pre-charge relay are switched off, obtaining a first phase shift of the AC signal between two sampling points according to first collected electrical signals; obtaining an internal side insulation resistance of the main relay according to the first collected electrical signals and the first phase shift; controlling the pre-charge relay to be switched on; when the main relay is switched off and the pre-charge relay is switched on, obtaining a second phase shift of the AC signal between the two sampling points according to second collected electrical signals; and obtaining an external side insulation resistance of the main relay according to the second collected electrical signals and the second phase shift.

A test device includes a diode junction layer having a first dopant conductivity region and a second dopant conductivity region formed within the diode junction layer on opposite sides of a diode junction. A first portion of vertical transistors is formed over the first dopant conductivity region as a device under test, and a second portion of vertical transistors is formed over the second dopant conductivity region. A common source/drain region is formed over the first and second portions of vertical transistors. Current through the first portion of vertical transistors permits measurement of a resistance at a probe contact connected to the common source/drain region.

A socket detection apparatus for supporting anomaly detection of an earth wire and a neutral wire includes: a micro-control unit, provided with a test plug of a fire wire connection end, a neutral wire connection end and an earth wire connection end, and a detection circuit connected with the test plug; and an induction antenna arranged corresponding to a fire wire end of a detected power socket, the induction antenna being connected with a first signal input end of the micro-control unit.