A socket detection apparatus for supporting anomaly detection of an earth wire and a neutral wire includes: a micro-control unit, provided with a test plug of a fire wire connection end, a neutral wire connection end and an earth wire connection end, and a detection circuit connected with the test plug; and an induction antenna arranged corresponding to a fire wire end of a detected power socket, the induction antenna being connected with a first signal input end of the micro-control unit.

A measurement module receives a defined system topology and system component characteristics information for a system. The measurement module calculates an expected system impedance for the defined system topology. The measurement module collects one or more impedance measurements using a high frequency voltage stimulus. Finally, the measurement module compares the one or more impedance measurements with the expected system impedance to determine adequacy of protective grounding of the system.

A probe card, a system for manufacturing a semiconductor device, and a method of manufacturing a semiconductor device are provided. A probe card includes a first probe configured to contact a first ground pad of a device under test, a reference resistor including a first terminal and a second terminal and connected to the first probe, and a second probe configured to contact a second ground pad of the device under test, wherein the second probe is further configured to be connected to a ground node for applying a reference potential, and the first terminal of the reference resistor is configured to be connected to the first probe and the second terminal of the reference resistor is configured to receive an input potential.

Provided are a method, apparatus and system for measuring a resistance parameter of a grounding system, and a monitoring network. The method comprises: inputting a driving current into a plurality of sections of a grounding system path (S602), wherein the grounding system path comprises at least a grounded apparatus, a grounding body, and a downlead connecting the grounded apparatus and the grounding body; measuring response voltages generated by the plurality of sections, and acquiring a response current flowing through the downlead (S604); and determining a resistance parameter of the grounding system path according to the driving current, the response voltages and the response current (S606).

Provided are a method, apparatus and system for measuring a resistance parameter of a grounding system, and a monitoring network. The method comprises: inputting a driving current into a plurality of sections of a grounding system path (S602), wherein the grounding system path comprises at least a grounded apparatus, a grounding body, and a downlead connecting the grounded apparatus and the grounding body; measuring response voltages generated by the plurality of sections, and acquiring a response current flowing through the downlead (S604); and determining a resistance parameter of the grounding system path according to the driving current, the response voltages and the response current (S606).

The invention relates to a control valve for adjusting a process fluid flow of a process plant, comprising a valve housing (8) with a valve seat (14) and a valve member (16) connected to a valve rod (18), which cooperates with the valve seat (14) for opening and closing the control valve (2), wherein the valve rod (18) is electrically connected to the valve housing (8) through a contact device (42, 43, 45). The invention is characterized in that a measuring device (26) for the ohmic transition resistance measurement of the contact device (42, 43, 45) is provided, and that the measuring device (26) is arranged in a measuring line (24) that connects the valve housing (8) to the valve rod (18).

The invention relates to a control valve for adjusting a process fluid flow of a process plant, comprising a valve housing (8) with a valve seat (14) and a valve member (16) connected to a valve rod (18), which cooperates with the valve seat (14) for opening and closing the control valve (2), wherein the valve rod (18) is electrically connected to the valve housing (8) through a contact device (42, 43, 45). The invention is characterized in that a measuring device (26) for the ohmic transition resistance measurement of the contact device (42, 43, 45) is provided, and that the measuring device (26) is arranged in a measuring line (24) that connects the valve housing (8) to the valve rod (18).

A display device including a first substrate including a display area and a non-display area, a circuit film connected to the first substrate, a printed circuit board (PCB) connected to the circuit film, and a first inspection pad, a second inspection pad, and a third inspection pad located in the non-display area and a bridge configured to electrically connect the first inspection pad, the second inspection pad, and the third inspection pad. The circuit film includes a first line electrically connected to the first inspection pad, a second line electrically connected to the second inspection pad, a third line electrically connected to the third inspection pad, and a branch point configured to branch at least one line from the first line, the second line, and the third line into two sub-lines. The PCB includes a test pad unit connected to the first line, the second line, and the third line.

A method for obtaining a contact resistance of a planar device includes: obtaining a contact resistance of a planar device by using a potential measurement method, in the measurement of the surface potential distribution, the planar device is in a state of current flowing, a certain voltage drop is formed at a junction area of the device; extracting the voltage drop measured through the Kelvin microscope by using a linear fitting method; and dividing the measured voltage drop by the current flowing through the device, thereby accurately calculating the magnitude of the contact resistance at the junction area of the planar device. With the present invention, the contact resistance of the planar device can be precisely measured, which is suitable for the contact resistance measurement experiments of devices such as thin film transistors and diodes. The invention has the advantages of reasonable theory, accurate result, simple and easy operation, and is favorable for optimizing the device performance and establishing a complete electrical model of the device.

A test method and device for a contact resistor are provided, configured to test a contact resistor of a metal-oxide-semiconductor (MOS) transistor. The method includes: a resistance value per area and a temperature coefficient of resistance of the contact resistor are acquired; and a target resistance value of the contact resistor is determined according to the resistance value per area, the temperature coefficient of resistance, and an area of the contact resistor.