One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object.

A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

A display panel testing bench, wherein the display panel testing bench comprises: a bench base, a chassis, a probe assembly, and a linkage assembly; a bench base moving assembly is disposed on the chassis; the bench base is movable on the chassis by the bench base moving assembly, the bench base is configured to fix a display panel; the linkage assembly is disposed on the chassis, and is configured to perform a joint movement of the probe assembly and the bench base; the probe assembly is disposed above the bench base; wherein, when the bench base is moved on the chassis by the bench base moving assembly, the bench base drives the linkage assembly, and the probe assembly is driven by the linkage assembly to move above the display panel.

The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

An apparatus includes an input probe configured to be placed on a first cluster of u-bumps disposed on a semiconductor die, output probes configured to be respectively placed on multiple clusters of u-bumps disposed on the semiconductor die, the multiple clusters being separately connected to the first cluster. The apparatus further includes a space transformer and printed circuit board (PCB) portion including a current source configured to supply a current to the input probe placed on the first cluster, resistors having a same resistance and being connected to ground, and tester channels at which voltages are respectively measured, the tester channels being respectively connected to ends of the output probes respectively placed on the multiple clusters and being respectively connected to the resistors. The apparatus further includes a processor configured to determine whether the input probe is properly aligned with the first cluster, based on the measured voltages.

A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board interconnecting various conductive elements. Disclosed herein is a transposed via arrangement within a circuit board for a probe card, where adjacent vias are offset towards each other such that the inductance between the adjacent vias may be reduced to provide a desirable impedance during high frequency signal and/or power transmission.

An eddy current system and methods of performing operations on a structure using the eddy current system are presented. The eddy current system comprises an ion beam source and a magnetic field source with at least one of variable output intensity or variable output orientation.

An eddy current system and methods of performing operations on a structure using the eddy current system are presented. The eddy current system comprises an ion beam source and a magnetic field source with at least one of variable output intensity or variable output orientation.