An LED package structure includes a multilayered circuit board, a plurality of lighting elements, a control unit, a reflecting unit, a package unit, a plurality of test paths and a plurality of operation paths. The multilayered circuit board includes a plurality of testing pads, a first electrical connecting pad and a plurality of second electrical connecting pads. The lighting elements are disposed on the multilayered circuit board. The control unit is electrically connected to the lighting elements. The reflecting unit is disposed on the multilayered circuit board and surrounds the lighting elements. The package unit covers the lighting elements. The test paths are in electrical connection with the first electrical connecting pad, the lighting elements and one of the testing pads. The operation paths are in electrical connection with the first electrical connecting pad, the control unit, the lighting elements and one of the second electrical connecting pads.

An electronic device including a processor and a sensor may be provided. The processor obtains a first degree of degradation of a first core based on a first parameter value associated with a lifetime of the first core and a first operating level associated with an operation of the first core. The processor obtains a second degree of degradation of a second core based on a second parameter value associated with a lifetime of the second core and a second operating level associated with an operation of the second core. The processor schedules a task of the first core and the second core based on the first degree of degradation and the second degree of degradation. The sensor provides the first parameter value and the first operating level to the first core and the second parameter value and the second operating level to the second core.

An electronic device including a processor and a sensor may be provided. The processor obtains a first degree of degradation of a first core based on a first parameter value associated with a lifetime of the first core and a first operating level associated with an operation of the first core. The processor obtains a second degree of degradation of a second core based on a second parameter value associated with a lifetime of the second core and a second operating level associated with an operation of the second core. The processor schedules a task of the first core and the second core based on the first degree of degradation and the second degree of degradation. The sensor provides the first parameter value and the first operating level to the first core and the second parameter value and the second operating level to the second core.

A gate driver circuit is provided that includes a high-side power transistor; a low-side power transistor coupled to the high-side power transistor, where an output voltage is generated at a load node coupled between the low-side power transistor and the high-side power transistor; a gate driver configured to receive a high-side control signal and a low-side control signal, drive the high-side power transistor based on the high-side control signal, and drive the low-side power transistor based on the low-side control signal; and a short circuit detection circuit configured to monitor for short circuit events at the high-side power transistor and at the low-side power transistor based on the high-side control signal, the low-side control signal, and the output voltage, and, generate a fault signal in response to detecting a short circuit event at either of the high-side power transistor or the low-side power transistor.

A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.

A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.

A method for characterizing an integrated circuit that selecting at least two devices from an integrated circuit for measuring light emission, wherein each of the at least two devices have experienced a different level of stress, applying power to the integrated circuit, and measuring the light emission from the at least two devices. The method also includes comparing the light emission that is measured from the at least two devices, wherein a difference between the light emission that is measured from the at least two devices greater than a predetermined ratio indicates that at least one of the devices from the at least two devices has a below specification performance.

The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

There is provided a method for correcting a relative position between a probe card having a plurality of cantilever-type probes and an object to be inspected having a plurality of electrode pads, including: arranging a first group of cantilever-type probes among the plurality of cantilever-type probes in a first region and a second region; arranging a second group of cantilever-type probes among the plurality of cantilever-type probes in a third region and a fourth region; obtaining needle traces formed on the plurality of electrode pads, which are generated when the first group of cantilever-type probes and the second group of cantilever-type probes that are arranged in the first region, the second region, the third region, and the fourth region, are brought into contact with the plurality of electrode pads; and correcting the relative position between the probe card and the object to be inspected based on the obtained needle traces.