A socket testing method comprises obtaining a raw socket image, performing binarization on the raw socket image to generate a binarized socket image, determining a plurality of pinhead locations in the binarized socket image, applying a grid with the grid including a plurality of intersections to the binarized socket image, for each of the plurality of pinhead locations, obtaining the distance between the pinhead location and one of the plurality of intersections which is nearest to the pinhead location, and outputting a warning signal associated with the pinhead location when determining that the distance is larger than a tolerance value.

A testing system includes a load board that includes a first circuit board, a first external connector attached to the first circuit board, and a thermal module configured to hold a system-on-wafer structure including a connector and a socket, a connector structure including a second circuit board, wherein the second circuit board is electrically connected to the first external connector, and a second external connector configured to connect to the connector of the system-on-wafer structure, and a test structure configured to connect to the socket of the system-on-wafer structure, the test structure including a third circuit board and pins, wherein adjacent pairs of pins of the test structure are electrically coupled through the third circuit board to form a continuous conductive path extending alternately between the system-on-wafer structure and the adjacent pairs of pins of the test structure.

A method for setting testing thresholds applied by a testing device to products being made includes obtaining an initial lower threshold for testing the products and counting, followed by manual review, first, second, third, and fourth type product qualities as being quantities under the initial lower threshold. The method adds a minimum product parameter of defective products, the initial lower threshold, and a number of values between the minimum product parameter and the initial lower threshold into a set, repeating the application of one selected element from the set as an experiment threshold. First to fourth type quantities of the current products are counted again under the experiment threshold, an effectiveness of each element of the set is calculated, and an element of the set with the maximum effectiveness is defined as a suggested lower threshold for testing the products.

According to some aspects of the present disclosure, power modules having current sensing circuits, and corresponding sensing methods, are disclosed. Example power modules include a printed circuit board (PCB) having a PCB trace, a first sense terminal coupled to the PCB trace at a first location, and a second sense terminal coupled to the PCB trace at a second location such that a resistance between the first and second sense terminals is defined by a resistance of the PCB trace between the first location and the second location. The power module further comprises a control coupled to the first sense terminal and the second sense terminal, the control adapted to measure a voltage between the first sense terminal and the second sense terminal and determine a current through the PCB trace based on the measured voltage and the resistance between the first sense terminal and the second sense terminal.

A socket testing method comprises obtaining a raw socket image, performing binarization on the raw socket image to generate a binarized socket image, determining a plurality of pinhead locations in the binarized socket image, applying a grid with the grid including a plurality of intersections to the binarized socket image, for each of the plurality of pinhead locations, obtaining the distance between the pinhead location and one of the plurality of intersections which is nearest to the pinhead location, and outputting a warning signal associated with the pinhead location when determining that the distance is larger than a tolerance value.

Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.

An instrument panel includes a frame defining an opening, a plurality of cards, and an HMI. The cards have a front face, a rear face, one or more circuits, and a data interface on the rear face in communication with the circuits. The cards include one or more first cards and one or more second cards. The first cards front face have a vertical dimension approximately equal to a vertical dimension of the opening. The second cards have a body, a nose projecting from the body defining the second cards front face, and a recess between the nose and body. The HMI includes a front face received within the opening. The first cards are positioned with the front face visible within the opening. The second cards are positioned with the nose visible within the opening and a depth of the HMI received within the recess.

An electronic device according to certain embodiments comprises a printed circuit board (PCB); a processor mounted on the PCB; and a connection interface configured to connect the PCB to an off-board electronic component, wherein the processor is configured to: output an inspection signal to the connection interface according to a particular bit pattern at a designated bit rate; identify a voltage level of a reception signal input to the processor, during a designated time, in response to the output of the inspection signal particular bit pattern; and determine a connection state of the connection interface based on the identified voltage level of the reception signal.

An automatic circuit board test system includes at least one switch module of board under test connected with a test board, a control module and a test process module. The test board includes a first signal interface, a second signal interface and a third signal interface and a repeater. The second signal interface and the third signal interface are mutually connected by a signal cable. The first signal interface is connected with the repeater. The at least one switch module of board under test is connected with the second signal interface and the third signal interface. The control module is connected with the at least one switch module of board under test. The control module controls the at least one switch module of board under test. The test process module is connected with the control module and the first signal interface by at least two serial port buses.

A control board (1) comprises connectors (15-1, 15-2) being connectable to source driver boards (3-1, 3-2) via cables (2-1, 2-2) comprising a plurality of signal lines (22); and a control circuit (11). The control circuit (11) transmits a predetermined plurality of test data values to source driver boards (3-1, 3-2) via first signal lines of the plurality of signal lines (22). Based on one encoded data value being generated from a plurality of test data values by the source driver boards (3-1, 3-2), the control circuit (11) determines whether the plurality of test data values are correctly transmitted to the source driver boards (3-1, 3-2). The control circuit (11) outputs a signal indicating whether the plurality of test data values are correctly transmitted to the source driver boards (3-1, 3-2).