This anisotropic conductive sheet (10) comprises: an insulating layer (11) having a first surface located on one side in the thickness direction, a second surface located on the other side, and a plurality of through holes (12) penetrating between the first surface and the second surface; a plurality of conductive layers (22) continuously arranged at the inner wall surface of the through holes in each of at least some of the plurality of through holes and around the openings of the through holes on the first surface; and a plurality of first grooves (14) that are arranged between the plurality of conductive layers on the first surface to insulate the conductive layers from each other, wherein the center of gravity (C2) of the opening of each through hole is set apart from the center of gravity (C1) of the respective conductive layer on the first surface.

A circuit board testing system includes a testing fixture. The testing fixture is used for testing plural wires of a cable of a circuit board. The testing fixture includes a first contact element, a switch circuit, a second contact element, a voltage acquisition element and a control unit. The first contact element is connected with input terminals of the plural wires. The second contact element is connected with output terminals of the plural wires. When the control unit drives a switching action of the switch circuit, a testing voltage is provided to the odd-numbered wires or the even-numbered wires. The control unit reads the voltage values of the odd-numbered wires and the voltage values of the even-numbered wires from the voltage acquisition element so as to judge whether the plural wires of the cable are normal.

An electronic circuit including: an electronic component, a conductive armature surrounding the electronic component, an electrical insulator between the electronic component and the conductive armature, a device configured to measure current passing through the armature or voltage on the armature or on the electronic component, and a defect determination device configured to determine a defect in the electrical insulator based on the measured current or voltage.

An instrument panel includes a frame defining an opening, a plurality of cards, and an HMI. The cards have a front face, a rear face, one or more circuits, and a data interface on the rear face in communication with the circuits. The cards include one or more first cards and one or more second cards. The first cards front face have a vertical dimension approximately equal to a vertical dimension of the opening. The second cards have a body, a nose projecting from the body defining the second cards front face, and a recess between the nose and body. The HMI includes a front face received within the opening. The first cards are positioned with the front face visible within the opening. The second cards are positioned with the nose visible within the opening and a depth of the HMI received within the recess.

[Problem]

To provide a probe and a probe device that can be easily attached to and detached from circuit boards and make it possible to conduct testing of circuit boards or electronic components in an efficient manner.

[Means of Solution]

A first clamping piece 20 has first clamping portions 25 at one end located adjacent to the circuit board P that make contact with one surface of a circuit board P; a second clamping piece 30 has a second clamping portion 31 at one end located adjacent to the circuit board P that makes contact with the other surface of the circuit board; the first clamping piece 20 and second clamping piece 30 have operative portions 26, 32 at the other end located on the side distal from the circuit board P for receiving an operating force opposing a biasing force exerted by a biasing member 40.

One aspect of this description relates to a testing apparatus including an advance process control monitor (APCM) in a first wafer, a plurality of pads disposed over and coupled to the APCM. The plurality of pads are in a second wafer. The testing apparatus includes a testing unit disposed between the first wafer and the second wafer. The testing unit is coupled to the APCM. The testing unit includes a metal structure within a dielectric. The testing apparatus includes a plurality of through silicon vias (TSVs) extending in a first direction from the first wafer, through the dielectric of the testing unit, to the second wafer.

An integrated circuit detection method, apparatus, and system are disclosed, which relate to the field of electronics and resolve a problem of detecting an electrical parameter of an integrated circuit on a printed circuit board in a power-on state. A specific solution is as follows: N detection circuits (101) are disposed, where each detection circuit (101) is connected to a different integrated circuit (102), the detection circuit (101) is provided with a first detection point (a) and a second detection point (b), and the detection circuit (101) is configured to detect the electrical parameter of the integrated circuit (102) that is connected to the detection circuit (101); and N is an integer greater than or equal to 1. The solution is used in a process of detecting the electrical parameter of the integrated circuit on the printed circuit board.

The present disclosure relates to a system and method for health monitoring and early warning for an electronic device. A sensor is used to monitor a physical parameter of a circuit board of a host electronic system of the electronic device to acquire sensor data, and transmit the acquired sensor data to an embedded control device. The sensor data includes at least one of current data, vibration data, temperature data and voltage data. The embedded control device is used to extract a feature from the sensor data to acquire feature data, and perform real-time analysis and prediction based on the feature data to obtain and display a prediction result. In this way, the user can be provided with real-time health monitoring and real-time prediction information for the host electronic system circuit board.

Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.

Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.