Systems, methods, and devices for monitoring operation of industrial equipment are disclosed. In one embodiment, a monitoring system is provided that includes a passive backplane and one more functional circuits that can couple to the backplane. Each of the functional circuits that are coupled to the backplane can have access to all data that is delivered to the backplane. Therefore, resources (e.g., computing power, or other functionality) from each functional circuits can be shared by all active functional circuits that are coupled to the backplane. Because resources from each of the functional circuits can be shared, and because the functional circuits can be detachably coupled to the backplane, performance of the monitoring systems can be tailored to specific applications. For example, processing power can be increased by coupling additional processing circuits to the backplane.

A flexible monitoring system and corresponding methods of use are provided. The system can include a base containing backplane, and one or more monitoring circuits. The monitoring circuits can be designed with a common architecture that is programmable to perform different predetermined functions. As a result, monitoring circuits can be shared between different implementations of the flexible monitoring system. Multiple bases that can be communicatively coupled in a manner that establishes a common backplane between respective bases that is formed from the individual backplanes of each base. Each monitoring circuit is not limited to sending data to and/or receiving data from the backplane to which it is physically coupled but can instead can communicate along the common backplane. Computational processing capacity can be increased or decreased independently of input signals received by addition or removal of processing circuits from the monitoring system.

A flexible monitoring system and corresponding methods of use are provided. The system can include a base containing backplane, and one or more circuits communicatively coupled to the backplane. The circuits can be designed with a common architecture that is programmable to perform different predetermined functions, such as input, output, and processing. By separating functions of the flexible monitoring system into different circuits, new implementations of the flexible monitoring system can be rapidly developed by arranging already created components in different combinations. Multiple bases can also be communicatively coupled in a manner that establishes a common backplane between respective bases. Accordingly, implementations of the flexible monitoring system distribute combinations of circuits across different bases, providing flexible deployment options.

A method of probing printed circuit boards that includes providing a circuit board design including a plurality of probe points, and selecting a probe point including a location ink from the plurality of probe points in the circuit board design to be probed on a physical printed circuit board design. The method continues with probing at least one probe point of the plurality of probe points with a probe that activates the location ink. Activation of the location ink by the probe indicates the selected probe point including the locating ink.

Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die, wherein the second face is opposite to the first face; circuitry; and a switch coupled between the second conductive contacts and the circuitry, wherein the circuitry is not electrically exposed by the second conductive contacts when the switch is open, and the circuitry is electrically exposed by the second conductive contacts when the switch is closed.

A potential difference early-warning circuit, comprising: a sensing resistor (R2), (PCB GND); a first MOS (M1), a drain of the first MOS being connected to the sensing resistor (R2), and a source of the first MOS (M1) being connected to a safety ground (GND); an operational amplifier (U1A), a positive input end of the operational amplifier being connected to one end of the sensing resistor (R2), and a negative input end of the operational amplifier (U1A) being connected to the other end of the sensing resistor (R2); a second MOS (M2), a gate of the second MOS (M2) being connected to an output end of the operational amplifier (U1A), and a source of the second MOS (M2) being connected to the signal ground; and a controller, a first input end of the controller being connected to the drain of the second MOS (M2), and an output end of the controller being connected to the gate of the second MOS (M2).

The present invention is directed to a system for testing printed circuit boards. The system is configured to test the simultaneously test a multiplicity of printed circuit boards. The system examines the electrical characteristics of a printed circuit board and is operable to identify if a printed circuit board meets a desired characteristic.

A method of probing printed circuit boards that includes providing a circuit board design including a plurality of probe points, and selecting a probe point including a location ink from the plurality of probe points in the circuit board design to be probed on a physical printed circuit board design. The method continues with probing at least one probe point of the plurality of probe points with a probe that activates the location ink. Activation of the location ink by the probe indicates the selected probe point including the locating ink.

A signal channel expanding system based on PAD is provided, including a motherboard disposed on an array tester and a plurality of array test pads disposed on a periphery of the motherboard and configured to control the motherboard; each of the array test pads includes a plurality of pins, each of the pins corresponds to a signal channel, the array test pads include at least two left driving array test pads and at least two right driving array test pads. Compared with the related art, in the signal channel expanding system based on PAD in the disclosure, by using at least two left driving array test pads and at least two right driving array test pads on the periphery of the motherboard, the number of the pins on the periphery of the motherboard can be multiplied and the pin size can remain unchanged without lengthening the test jig.

A circuit board testing system includes a testing fixture. The testing fixture is used for testing plural wires of a cable of a circuit board. The testing fixture includes a first contact element, a switch circuit, a second contact element, a voltage acquisition element and a control unit. The first contact element is connected with input terminals of the plural wires. The second contact element is connected with output terminals of the plural wires. When the control unit drives a switching action of the switch circuit, a testing voltage is provided to the odd-numbered wires or the even-numbered wires. The control unit reads the voltage values of the odd-numbered wires and the voltage values of the even-numbered wires from the voltage acquisition element so as to judge whether the plural wires of the cable are normal.