A housing part (10) for a sensor has a transparent, hollow base body which has a toothing (14) in the form of a straight-toothed gearwheel in a circular-cylindrical emission region on its lateral surface. A circuit board of the sensor is partially arranged in the housing part (10). The circuit board has at least one light source which faces the emission region.

An embodiment of the invention provides a radio frequency (RF) device calibration method. The method includes: obtaining a measurement result of a channel of a first-stage device under a control condition; obtaining a reference measurement result of a reference channel of a second-stage device, wherein the channel corresponds to the reference channel, and the measurement result and the reference measurement result are measured before the first-stage device and the second-stage device are assembled into an RF device; determining an estimated measurement result corresponding to the channel based on the measurement result and the reference measurement result; obtaining a post-assembly measurement result of the channel of the RF device under the control condition after the first-stage device and the second-stage device are assembled into the RF device; and performing a calibration operation corresponding to the channel based on the estimated measurement result and the post-assembly measurement result.

Various devices, methods and systems are provided for aging-sensitive chip authentication. In one example, among others, a chip includes a reference Schmitt trigger ring oscillator (STRO) configured to enter a sleep mode during operation of the chip; a stressed STRO; a VDD charge pump configured to boost a positive voltage supplied to the stressed STRO during operation of the chip; and/or a GND charge pump configured to under-drive a ground voltage supplied to the stressed STRO during operation of the chip. In another example, a method includes detecting activation of a chip including a reference STRO and a stressed STRO and, in response to the activation of the chip, initiating sleep mode operation of the reference STRO. In response to the activation of the chip, a VDD voltage supplied to the stressed STRO can be boosted and/or a GND voltage supplied to the stressed STRO can be under-driven.

A method of diagnosing an abnormal state of a substrate-processing apparatus includes measuring a temperature of a chuck in the substrate-processing apparatus. The temperature of the chuck is compared to a target temperature of the chuck, with a temperature-controlling unit. A control signal is analyzed to diagnose an abnormal state of the substrate-processing apparatus. The control signal is transmitted from the temperature-controlling unit to a drive parameter-applying unit configured to provide the chuck with a drive parameter.

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a substrate. The electronic device package can also include an electronic component disposed on the substrate and electrically coupled to the substrate. The electronic device package can further include a connector disposed on the substrate and electrically coupled to the substrate for communication with the electronic component. The connector can have a contact to interface with a mating connector and configured to provide a signal and/or power to the electronic component to facilitate testing the electronic component. Additionally, the electronic component can include an encapsulant material disposed on the substrate and at least partially encapsulating the electronic component and/or the connector. The contact can be accessible on a top side of the electronic device package to facilitate coupling the connector to a testing device. Associated systems and methods are also disclosed.

A plug device for automatically plugging a display panel and a connector comprises a first linkage having a fixed end and a movable end that can approach or get away from the display panel at a plug location. The connector comprises a first connector head, a second connector head and a wire that connects the first and second connector heads, the connector is mounted on the first linkage, the first and second connector heads of the connector are respectively secured on the movable end and the fixed end of the first linkage. The second connector head is connected with a signal generator, and when the movable end approaches the display panel at the plug location, the first connector head is automatically plugged on the display panel. The plug device may be used in a method of automatically plugging a display panel with a connector.

Various devices, methods and systems are provided for aging-sensitive chip authentication. In one example, among others, a chip includes a reference Schmitt trigger ring oscillator (STRO) configured to enter a sleep mode during operation of the chip; a stressed STRO; a VDD charge pump configured to boost a positive voltage supplied to the stressed STRO during operation of the chip; and/or a GND charge pump configured to under-drive a ground voltage supplied to the stressed STRO during operation of the chip. In another example, a method includes detecting activation of a chip including a reference STRO and a stressed STRO and, in response to the activation of the chip, initiating sleep mode operation of the reference STRO. In response to the activation of the chip, a VDD voltage supplied to the stressed STRO can be boosted and/or a GND voltage supplied to the stressed STRO can be under-driven.

An array substrate, and a display panel and a test method therefor are provided. The array substrate includes a plurality of display signal lines disposed in a display area, and a plurality of first pads and a plurality of second pads disposed in a peripheral area around the display area and electrically connected to the respective plurality of display signal lines. A first test area and a second test area are disposed in a first direction on two sides of a primary area respectively. The first pad includes a first primary part and the second pad includes a second primary part. The first primary parts and the second primary parts are disposed in the primary area and are disposed alternately in a second direction.

A capacitance acquiring unit acquires a plurality of initial capacitance values indicating capacitance values of a smoothing capacitor in an initial state and acquires a plurality of operation capacitance values indicating capacitance values of the smoothing capacitor in an operation state, and a deterioration determining unit acquires characteristic information indicating a relationship between AC power and the capacitance value of the smoothing capacitor in the initial state on the basis of a statistic amount of the plurality of initial capacitance values acquired by the capacitance acquiring unit and determines a deterioration state of the smoothing capacitor on the basis of a statistic amount of the plurality of operation capacitance values acquired by the capacitance acquiring unit and the characteristic information.

Embodiments of the present disclosure disclose a method for on-site monitoring of performance of energy devices. The method comprises measuring a value associated with one or more energy parameters of one or more energy devices in real time. The method further comprises comparing the measured value of the one or more energy devices with a predefined set of tolerance values corresponding to the one or more energy parameters of the one or more energy devices. The method further comprises indicating a result of the comparison on a display unit associated with the testing apparatus for on-site monitoring performance of the one or more energy devices.