Patent classifications
G01R31/2851
POWER CONSUMPTION MEASUREMENT ASSEMBLY AND METHOD, AND CHIP POWER CONSUMPTION MEASUREMENT DEVICE
A power consumption measurement assembly includes: at least two sampling modules respectively connected to a circuit to be measured in series; a gating module configured to gate one of the at least two sampling modules; an amplifying module configured to acquire and amplify a voltage signal across the gated sampling module; and a processing module connected to the gating module and the amplifying module and configured to: control and adjust the gated sampling module and an amplification of the amplifying module, calculate a power consumption value based on the amplified voltage signal and transmit the power consumption value.
On-chip oscilloscope
A device includes a control circuit, a scope circuit, a first logic gate and a second logic gate. The control circuit is configured to generate a first control signal according to a voltage signal and a delayed signal. The scope circuit is configured to generate a first current signal in response to the first control signal and the voltage signal. The first logic gate is configured to perform a first logical operation on the voltage signal and one of the voltage signal and the delayed signal to generate a second control signal. The second logical gate configured to perform a second logical operation on the second control signal and a test control signal to generate a second current signal.
Usage metering by bias temperature instability
Techniques for usage metering by bias temperature instability with differential sensing on pairs of matching transistors are provided. In one aspect, a usage metering device includes: at least one metering circuit on a chip, the at least one metering circuit having a pair of matching transistors, and a differential current sense circuit connected to the pair of matching transistors, wherein the pair of matching transistors includes a reference transistor which is unused during regular operation of the chip, and a stressed transistor that is on continuously during the regular operation of the chip, and wherein the differential current sense circuit determines a Vt difference between the reference transistor and the stressed transistor. A method for usage metering and a method of forming a usage metering device are also provided.
Integrated circuit with optical tunnel
The invention relates to an integrated circuit with an active transistor area and a plurality of wiring layers arranged above the active transistor area. At least one optical device is integrated in the active transistor area. The optical device is electrically connected with at least one of the wiring layers. At least one optical tunnel extends from the at least one optical device through the plurality of wiring layers to a surface of an uppermost wiring layer of the plurality of wiring layers facing away from the active transistor area.
Test array structure, wafer structure and wafer testing method
A test array structure includes a substrate, first and second cells, first and second bit-line rings and four word-lines. Each of the first and second cells has a first drain region, a first gate region, a source region, a second gate region and a second drain region connected together in sequence. The first drain region and the first gate region of the first cell are located within the first bit-line ring. The second drain region and the second gate region of the first cell are located between the first and second bit-line rings. The first drain region and the first gate region of the second cell is located within the second bit-line ring. The second drain region of the first cell and the first drain region of the second cell are located between the two immediately-adjacent word-lines.
INTERFACE TO FULL AND REDUCED PIN JTAG DEVICES
The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.
TEST CIRCUIT AND ELECTRONIC DEVICE
A test circuit testing a storage circuit and including a controller, a pattern-generator circuit, a comparing circuit, and a first register is provided. The controller is configured to generate a plurality of internal test signals. The pattern-generator circuit writes test data into the storage block of the storage circuit according to the internal test signal and reads the storage block to generate read data. The comparing circuit compares the test data and the read data to generate a test result. The first register stores the test result. The controller determines whether the storage circuit is working normally according to the test result stored in the first register.
System and method for performing a test procedure
A system and method for performing a test procedure on a system under test are provided. An actuation unit operatively coupled to the system under test is configured to perform at least one operation thereon. A visual recognition unit is configured to capture at least one image of the system under test in real-time. A test unit remotely interfaced with the system under test is configured to perform the test procedure. Using the test unit, the test procedure is retrieved from the memory, at least one control signal is output to the actuation unit for causing the at least one operation to be performed in real-time for testing the system under test in accordance with the one or more test instructions, and the at least one image of the system under test is monitored as the at least one operation is performed for validating the test procedure in real-time.
Computer system power monitoring
A voltage regulator circuit included in a computer system may generate a voltage level on a power supply signal using a source power supply signal and based initial values of one or more operation parameters derived from wafer-level test data. One or more operation characteristics of the voltage regulator circuit may be sampled, by a measurement circuit, at multiple time points to generated measurement data. A control circuit may adapt operation of the voltage regulator circuit based on the measurement data.
Systems and methods for testing electrical leakage
A method of testing a self-contained device under test having at least a circuit under test and a power source is provided. The method may include at least temporarily enabling power from the power source to the circuit under test, determining a first voltage across the circuit under test, determining a second voltage across the circuit under test after a test duration, and calculating an average current of the circuit under test based at least partially on the first voltage, the second voltage and the test duration.