Systems and methods are provided for Integrated Circuit (IC) identification, authentication, and tamper detection. Die identification, authentication, and tamper detection techniques are described that employ capacitive sensing of on-chip interconnect. The signal and power routing in ICs have nominal capacitance values that are characteristic of their foundry, and the variance of these values, due to process tolerances, is unique to each device. Measuring these capacitances provides not only support for determining the authenticity of the device and fabrication site, but also provides distinct identification of each part. By integrating Capacitance-to-Digital Converters (CDCs) with low power and area overhead, capacitance values from intrinsic functional nets can be reported, and the need for separate additive test circuitry can be avoided.

Disclosed are representative embodiments of methods, apparatus, and systems for test scheduling and test access in a test compression environment. Clusters of test patterns for testing a plurality of cores in a circuit are formed based on test information that includes compressed test data, corresponding tester channel requirements and correlated cores. The formation of test pattern clusters is followed by tester channel allocation. A best-fit scheme or a balanced-fit scheme may be employed to generate channel allocation information. A test access circuit for dynamic channel allocation can be designed based on the channel allocation information.

The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure, messages are modulated over DC voltages applied to the power terminals of a device to input test/debug messages to the device and output test/debug messages from the device. The present disclosure advantageously allows a device to be tested and/or debugged without the device having any shared or dedicated test or debug interface terminals.

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

A method is disclosed use with a circuit device that includes a circuit having a predetermined voltage-current characteristic and a detector configured to detect a voltage-current relation of the circuit. The method includes using the detector to detect the voltage-current relation of the circuit, and indicating if the detected voltage-current relation differs from the predetermined voltage-current characteristic. A circuit device includes a circuit having a predetermined voltage-current characteristic, and a detector configured to detect a voltage-current relation of the circuit. The circuit device is configured to indicate if the detected voltage-current relation differs from the predetermined voltage-current characteristic.

Computer implemented methods of designing integrated circuits and computing systems are provided. A computer implemented method of designing an integrated circuit according to the inventive concepts may be performed by a processor and may include performing a placement and routing (P&R) operation for standard cells defining the integrated circuit, extracting characteristic values from a result of the P&R operation, generating a physical-aware annotation file by determining a plurality of representative characteristic values that respectively correspond to a plurality of groups based on the extracted characteristic values, and performing a physical-aware synthesis operation to generate a netlist from input data for the integrated circuit, based on the generated physical-aware annotation file.

The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.

A sensor integrated circuit including a regulator for generating a regulated voltage includes a digital load configured to draw a load current from the regulator in response to a clock signal during in situ operation and a comparator configured to determine the absence or presence of a fault during in situ operation. The load current is less than or equal to a predetermined level in the absence of a fault and is greater than the predetermined level in the presence of a fault. The comparator is responsive to the load current and to a threshold level and is configured to generate a comparator output signal having a level indicative of whether the load current is less than or greater than the threshold level in order to thereby determine the absence or presence of a fault during in situ operation, respectively.

The invention relates to an integrated circuit with an active transistor area and a plurality of wiring layers arranged above the active transistor area. At least one optical device is integrated in the active transistor area. The optical device is electrically connected with at least one of the wiring layers. At least one optical tunnel extends from the at least one optical device through the plurality of wiring layers to a surface of an uppermost wiring layer of the plurality of wiring layers facing away from the active transistor area.

An assembly for connecting controlled-impedance cables to a PCB using a crescent-shaped connector that can be located much closer to the unit under test than those of the prior art. On the PCB, equal-length signal traces run from UUT contacts to signal pads that form an arc. All signal pads are surrounded by a ground land. The connector has an anchor block for permanently or removably securing the cables. The connector uses skewed coil contacts held within an electrically conductive plate. The signal contacts are captured in signal through apertures within insulating plugs in the plate. The ground contacts are captured in a ground through apertures. Each signal contact is electrically connected to a cable signal conductor and the ground contacts are electrically connected to the anchor block or ferrule. The connector is shaped so that the signal contacts trace an arc, so that they align with the signal pads.