A method of monitoring joint and contact conditions in an automatic transfer switch includes: collecting electrical signals at a plurality of measurement locations associated with a plurality of power sources and a load over a predetermined period, the electrical signals including voltages and load current; obtaining deltas between source voltages and corresponding load voltage measured at the measurement locations over the predetermined period; comparing the deltas with thresholds obtained during healthy condition; determining that the deltas fall outside of the thresholds; and in response to determining that the deltas fall outside of the threshold, transmitting an alert to a user, the alert indicating a detection of one or more failure modes at the measurement locations.

A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.

A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.

Techniques, systems and articles are described for monitoring electrical equipment of a power grid and predicting likelihood failure events of such electrical equipment. In one example, a cable accessory is configured to couple to an electrical power cable and includes a partial discharge sensor and a communications unit. The partial discharge sensor is configured to detect partial discharge events and output data indicative of the partial discharge events. The communications unit is configured to output event data based at least in part on the partial discharge data.

A device may include a receive antenna input to couple a receive antenna to a receive chain of the device. The device may include a test signal generator to generate a test signal. The device may include a signal coupler between the receive antenna input and the receive chain. The signal coupler may include a first port to inject the first test signal into the receive antenna via the receive antenna input. The device may include a control circuit to monitor an impedance matching of the receive antenna based on one or more characteristics of a reflected signal resulting from the first test signal being injected into the receive antenna. The one or more characteristics of the reflected signal may be dependent on the impedance matching of the receive antenna.

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

A patch cord, a management system and a management method thereof are provided. The patch cord (10) comprises a connection line portion (11), a first connector (21) arranged at a first end of the connection line portion (11), a second connector (22) arranged at a second end of the connection line portion (11), a first communication unit (31) arranged at near the first connector (21) including a first identifier and a second communication unit (32) arranged near the second connector (22) including a second identifier, wherein the first and second identifiers contain unique identify information for identifying the first connector and the second connector, respectively, and wherein the first identifier is different from the second identifier. The management system and the management method can differentiate connectors at the both ends of the patch cord by self-identification.

A method for determining a connection status of a device to a cable within a network environment is provided. The method comprises obtaining a signal from a non-data carrying wire of the cable by a detector that is digitally isolated from data transmitted in a data carrying wire of the cable within the network environment, modifying the signal transmitted by the non-data carrying wire to the device and evaluating the modified signal to determine a connection status of the device to the cable.

A method for determining a connection status of a device to a cable within a network environment is provided. The method comprises obtaining a signal from a non-data carrying wire of the cable by a detector that is digitally isolated from data transmitted in a data carrying wire of the cable within the network environment, modifying the signal transmitted by the non-data carrying wire to the device and evaluating the modified signal to determine a connection status of the device to the cable.