Patent classifications
G01R33/06
Non-orthogonality adjustment based on a duty cycle
According to some embodiments, a method implemented in electronic circuitry includes: receiving a first signal having a sinusoidal waveform; receiving a second signal having a sinusoidal waveform; generating a composite signal responsive to the first and second signals; determining an orthogonality adjustment coefficient based on a duty cycle of the composite signal; and applying the orthogonality adjustment coefficient to generate an adjusted second signal that is substantially orthogonal to the first signal.
Non-orthogonality adjustment based on a duty cycle
According to some embodiments, a method implemented in electronic circuitry includes: receiving a first signal having a sinusoidal waveform; receiving a second signal having a sinusoidal waveform; generating a composite signal responsive to the first and second signals; determining an orthogonality adjustment coefficient based on a duty cycle of the composite signal; and applying the orthogonality adjustment coefficient to generate an adjusted second signal that is substantially orthogonal to the first signal.
SENSOR INTEGRATED CIRCUIT WITH INTEGRATED COIL
A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
SENSOR INTEGRATED CIRCUIT WITH INTEGRATED COIL
A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material
A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.
Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material
A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.
BIPOLAR CHOPPING FOR 1/F NOISE AND OFFSET REDUCTION IN MAGNETIC FIELD SENSORS
A chopping technique, and associated structure, is implemented to cancel the magnetic 1/f noise contribution in a Tunneling Magnetoresistance (TMR) field sensor. The TMR field sensor includes a first bridge circuit including multiple TMR elements to sense a magnetic field and a second circuit to apply a bipolar current pulse adjacent to each TMR element. The current lines are serially or sequentially connected to a current source to receive the bipolar current pulse. The field sensor has an output including a high output and a low output in response to the bipolar pulse. This asymmetric response allows a chopping technique for 1/f noise reduction in the field sensor.
BIPOLAR CHOPPING FOR 1/F NOISE AND OFFSET REDUCTION IN MAGNETIC FIELD SENSORS
A chopping technique, and associated structure, is implemented to cancel the magnetic 1/f noise contribution in a Tunneling Magnetoresistance (TMR) field sensor. The TMR field sensor includes a first bridge circuit including multiple TMR elements to sense a magnetic field and a second circuit to apply a bipolar current pulse adjacent to each TMR element. The current lines are serially or sequentially connected to a current source to receive the bipolar current pulse. The field sensor has an output including a high output and a low output in response to the bipolar pulse. This asymmetric response allows a chopping technique for 1/f noise reduction in the field sensor.
MICRO-FLUXGATE SENSOR
A micro-fluxgate sensor has a double-iron core assembly, a self-oscillating module, a current superimposing and amplifying module and a voltage acquisition module. The double-iron core assembly comprises a first iron core and a second iron core. The first iron core is provided with a first winding coil. The second iron core is provided with a second winding coil. The first winding coil and the second winding coil are respectively connected with an input end of the self-oscillating module, and an output end of the self-oscillating module is respectively connected with the current superimposing and amplifying module and the voltage acquisition module. The fluxgate sensor is simple in processing circuit without manual debugging and is easily integrated.
Arrangement, method and sensor for measuring an absolute angular position using a multi-pole magnet
A system for measuring an angular position of a rotor with respect to a stator, wherein the rotor is rotatable around a rotation axis, the system comprising: a magnetic source mounted on the rotor, having at least four magnet poles and providing a periodically repetitive magnetic field pattern with respect to the rotation axis; a sensor mounted on the stator and comprising a plurality of sensor elements for measuring at least one magnetic field component of the magnetic field and for providing a measurement signal thereof; the sensor being located substantially centered around the rotation axis, in a plane substantially perpendicular to the rotation axis at a first distance from the magnetic source; the sensor elements being located substantially on a circle at a second distance from the rotation axis; a calculator that determines the angular position by calculating it from the measurement signals.