In one example, there is provided a matrix of detectors configured to be used in a system for inspecting cargo using inspection radiation. The matrix includes a plurality of columns of detector modules, the detector modules of each column extending along a substantially longitudinal direction, each detector module including a surface configured to receive the inspection radiation, and the plurality of columns of detector modules being adjacent to each other in a lateral direction substantially perpendicular to the longitudinal direction and substantially parallel to the surfaces of the detector modules, wherein the plurality of columns of detector modules includes at least two columns of detector modules being offset with respect to each other in an in-depth direction substantially perpendicular to both the lateral direction and the longitudinal direction.

X-ray detectors for generating digital images are disclosed. An example digital X-ray detector includes: a scintillation screen; a reflector configured to reflect light generated by the scintillation screen; and a digital imaging sensor configured to generate a digital image of the light reflected by the reflector.

X-ray detectors for generating digital images are disclosed. An example digital X-ray detector includes: a scintillation screen; a reflector configured to reflect light generated by the scintillation screen; and a digital imaging sensor configured to generate a digital image of the light reflected by the reflector.

A medical imaging system for detecting ionizing radiation. The system includes one or more pixilated imagers positioned to acquire patient image data and one or more position sensors positioned to acquire patient position data. Once the patient image data and patient position data are acquired, one or more processors operably connected to each of the one or more pixilated imagers and one or more position sensors calculate a three-dimensional mass distribution based on patient image data and patient position data.

A method and apparatus are provided for nonlinear energy correction of a gamma-ray detector using a calibration spectrum acquired from the background radiation of lutetium isotope 176 (Lu-176) present in scintillators in the gamma-ray detector. Further, by periodically acquiring Lu-176 spectra using the background radiation from the scintillators, the nonlinear energy correction can be monitored to detect when changes in the gamma-ray detector cause the detector to go out of calibration, and then use a newly acquired Lu-176 spectrum to update the calibration of the nonlinear energy correction as needed. The detector calibration is performed by comparing a reference histogram to a calibration histogram generated using the nonlinear energy correction, and adjusting the parameters of the nonlinear energy correction until the two histograms match. Alternatively, the detector calibration is performed by comparing reference and calibration values for specific spectral features, rather than for the whole Lu-176 spectrum.

The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.

Provided are a scintillator and the like capable of improving emission intensity. A scintillator (S) comprises a sapphire substrate (6), a GaN layer (4) that is provided on the incident side to the sapphire substrate (6) and includes GaN, a quantum well structure (3) provided on the incident side to the GaN layer (4), and a conductive layer (2) provided on the incident side to the quantum well structure (3), wherein a plurality of emitting layers (21) including InGaN and a plurality of barrier layers (22) including GaN are alternatively stacked in the quantum well structure (3), and an oxygen-containing layer (23) including oxygen is provided between the quantum well structure (3) and the conductive layer (2).

Some embodiments include a sensor unit with a conversion element and a readout substrate. The conversion element has imaging pixels and each imaging pixel is configured to directly convert radiation into an electrical charge. Each imaging pixel has a charge collection electrode. The imaging pixels have first imaging pixels and second imaging pixels. The readout substrate has a plurality of readout pixels arranged in a grid. Each readout pixel is connected to an associated imaging pixel by means of an interconnection at a connection position on the charge collection electrode. The second imaging pixels are shifted in a shifting direction relative to the first imaging pixels. The connection positions, in relation to the charge collection electrodes, are different between the first imaging pixels and the second imaging pixels.

Some embodiments include a sensor unit with a conversion element and a readout substrate. The conversion element has imaging pixels and each imaging pixel is configured to directly convert radiation into an electrical charge. Each imaging pixel has a charge collection electrode. The imaging pixels have first imaging pixels and second imaging pixels. The readout substrate has a plurality of readout pixels arranged in a grid. Each readout pixel is connected to an associated imaging pixel by means of an interconnection at a connection position on the charge collection electrode. The second imaging pixels are shifted in a shifting direction relative to the first imaging pixels. The connection positions, in relation to the charge collection electrodes, are different between the first imaging pixels and the second imaging pixels.

A radiation imaging system comprises: an image obtaining unit including a radiation detecting unit in which pixels configured to output signals according to a dose of irradiated radiation are arranged in a two-dimensional area, and configured to obtain a radiation image based on the signals; a correction unit configured to correct the radiation image using an input/output characteristic of a pixel, which represents a relationship between the dose of radiation on the pixel and the signal output from the pixel and is obtained using gain data based on a plurality of gain images obtained under different doses; and an updating unit configured to update the gain data using an updating coefficient obtained based on the gain data and a gain image newly obtained by the image obtaining unit.