Disclosed is a lens assembly applied to a small mobile device. The lens assembly includes: a base; a support inserted into the base to be moved in an optical-axis direction; a lens module coupled to the support and disposed in the base; first and second optical image stabilization drive units each configured to move the lens module in a direction perpendicular to an optical-axis direction; and a plurality of hinge members configured to support the lens module to be moved with respect to the support, wherein each of the plurality of hinge members has one end connected to a coupling groove of the lens module and the other end connected to a coupling groove of the support, and the coupling groove of the lens module and the coupling groove of the support are open in the same direction as each other.

Digital camera systems and methods are described that provide a color digital camera with direct luminance detection. The luminance signals are obtained directly from a broadband image sensor channel without interpolation of RGB data. The chrominance signals are obtained from one or more additional image sensor channels comprising red and/or blue color band detection capability. The red and blue signals are directly combined with the luminance image sensor channel signals. The digital camera generates and outputs an image in YCrCb color space by directly combining outputs of the broadband, red and blue sensors.

The present technology relates to a solid-state imaging device, a production method, and an electronic apparatus that can prevent sensitivity unevenness from generating. The solid-state imaging device includes a pixel array unit having a plurality of pixels, a microlens formed by laminating a plurality of lens layers for the every pixel, and a film formed between the lens layers with a uniform film thickness having a refractive index lower than a refractive index of the lens layer. The present technology is applicable to an amplification type solid-state imaging device such as a surface irradiation type or rear irradiation type CMOS image sensor, and a charge transfer type solid-state imaging device such as a CCD image sensor.

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

An imaging device includes a light shield that has light shielding walls and a plurality of light transmissive parts in a plurality of apertures between the light shielding walls and a light-receiving element layer in which a large number of light-receiving elements that perform photoelectric conversion corresponding to incident light inputted through the light transmissive parts of the light shield are arranged to acquire image information that has passed through optical elements that are different between the adjacent light transmissive parts. Further, the image information that passed through optical elements being different for every one of the light transmissive parts adjacent is acquired, and therefore, the sensor areas of the light receiving element is utilized effectively.

A plastic barrel including an object-end portion, a holder portion, and a tube portion is proposed. The object-end portion includes an outer object-end surface, an object-end hole, and an inner annular object-end surface. A part of the inner annular object-end surface is connected with the outer object-end surface and surrounding the object-end hole. The holder portion includes a bottom surface, a bottom hole, and an outer bottom side. The bottom surface surrounds the bottom hole and is connected with the outer bottom side. The holder portion further includes cut traces formed by partially removing gate portions. The tube portion includes inner annular surfaces and connects the object-end portion with the holder portion.

An optical device that can adjust the optical characteristics by a simple structure and a fabrication method thereof are provided. The optical device (10A) has a first electrode layer (12A), a second electrode layer (14A), a polymer layer (11) provided between the first electrode layer (12A) and the second electrode layer (14A), and a spacer layer (13A) positioned between the polymer layer and the second electrode layer to provide a prescribed space (17) between the polymer layer (11) and the second electrode layer (14A), the spacer layer being an electrical insulator, wherein the polymer layer (11) deforms into one or more light scatterers (15) in the prescribed space by applying voltage.

A lens assembly includes a lens including an optical portion refracting light and a flange portion extending along a portion of a circumference of the optical portion, a blocking member disposed in front of the lens and having an opening to allow light to be incident on the lens, and a lens barrel accommodating the lens. The optical portion is noncircular and a portion of the blocking member facing the optical portion in an optical axis direction is located to be higher than a portion of the blocking member facing the flange portion in the optical axis direction.

An example optical substrate, according to aspects of the present disclosure, includes a support structure, a plurality of optical components, and a plurality of flexures. Each flexure is engaged with the support structure and a respective optical component for allowing independent lateral movements of the optical components during assembly of the optical substrate with another layer of an optical assembly.

A vehicular exterior rearview mirror assembly includes a mirror casing, a mirror reflective element and a ground illumination module having a freeform optic, a ground illumination light source, and first, second and third icon light sources. With the vehicular exterior rearview mirror assembly mounted at the side of the vehicle and when the ground illumination light source is electrically powered to emit light, light emitted by the ground illumination light source that passes through the freeform optic illuminates the ground region adjacent to and along the side of the vehicle with a ground illumination intensity. When each individual icon light source is electrically powered to emit light, light emitted by the respective icon light source projects a respective projected image onto an icon region that is within the ground region. The respective projected images are individually projected to provide animated images projected onto the icon region.