A light modulator includes a beam homogenizer having microstructure, and a curved light transmitting substrate having at least one curving surface, wherein the beam homogenizer is arranged on the curving surface of the curved light transmitting substrate to configure the microstructure of the beam homogenizer on the curving surface of the curved light transmitting substrate.

An optical lens includes a transparent portion and a flange portion surrounding the transparent portion. The flange portion includes a connecting portion, a transition portion, and an edge portion. The connecting portion is coupled between the transparent portion and the transition portion. The transition portion is coupled between the connecting portion and the edge portion. The flange portion defines a V-shaped groove. The V-shaped groove surrounds the transparent portion.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Various embodiments include a display panel with integrated micro lens array. The display panel typically includes an array of pixel light sources (e.g., LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The array of micro lenses are aligned to the pixel light sources and positioned to reduce the divergence of light produced by the pixel light sources. The display panel may also include an integrated optical spacer to maintain the positioning between the micro lenses and pixel driver circuits.

A lens assembly includes a lens including an optical portion refracting light and a flange portion extending along a portion of a circumference of the optical portion, a blocking member disposed in front of the lens and having an opening to allow light to be incident on the lens, and a lens barrel accommodating the lens. The optical portion is noncircular and a portion of the blocking member facing the optical portion in an optical axis direction is located to be higher than a portion of the blocking member facing the flange portion in the optical axis direction.

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

A printing system capable of accurately positioning a lenticular array in registration with a rectilinear raster includes a printer that is capable of printing onto a printable surface. The printer has a main support surface on which the printable surface rests. The system further includes a series of raised parallel relief features being spatially formed along a printable substrate that is supported by the main support surface. The raised parallel relief features are raised to a sufficient height above the printable substrate such that when the lenticular array is disposed upon the raised parallel relief features, each raised parallel relief feature fits and is disposed within a valley formed between two respective adjoining lenticules of the lenticular array.

The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.