Microlens array formation and alignment to heterogeneously integrated optoelectronic devices. Optoelectronic devices are printed or transferred in a single process step while also creating inactive optoelectronic devices that are precisely shaped for alignment purposes rather than for optical or electrical performance. Microlenses are integrated monolithically. The microlenses are aligned directly to a fiducial generated by the device integration step, reducing overall misalignment. Additionally, we use specific optical designs for the lenses to add novel functionalities to the system. By designing the lenses with engineered offsets, distances and curvatures with respect to the arrays of optoelectronic devices, we control properties of light such as: angles, phase, beam widths, and wavelength dependence.

There is provided a technique that can suppress generation of flare and/or ghost by incident light reflecting off an inner wall of the spacer in a lens unit including a wafer-level lens and a spacer. A lens unit is formed by joining a lens portion including a lens and a spacer portion including a through hole through which light emitted from the lens passes, in which the spacer portion includes, in an end surface in which the lens portion is joined, an opening portion of the through hole and an inner wall portion, which is a wall surface of an outer edge of the opening portion, and the inner wall portion has a surface roughness greater than a surface roughness of an end surface of the spacer portion opposite to the end surface in which the lens portion is joined.

The invention provides an automotive lighting device with a circuit support, an optics support, a holder support and a microlenses support. The optics support includes optical elements, each one being arranged in front of one of the solid-state light sources of the printed circuit board. The optics support further includes positioning protrusions configured to fit the positioning housings of the circuit support. The holder support includes a plurality of opaque walls, a first coupler and a second coupler. Each opaque wall is located between two optical elements. The microlenses support includes a plurality of groups of microlenses, each group having a plurality of microlenses arranged to receive the light projected by one optical elements. The first coupler is configured to couple the holder support to the circuit support. The second coupler is intended to retain the microlenses support.

An optical construction includes a lens layer having a structured first major surface including a plurality of microlenses; an optical filter disposed on the lens layer; an optically opaque mask layer disposed between the lens layer and the optical filter and defining a plurality of openings therein; and a low index layer disposed on the optical filter. For a first wavelength in a visible wavelength range, a second wavelength that can be in an infrared wavelength range, the optical filter has: an optical transmission of greater than about 50% for the first wavelength for each of a first incident angle of less than about 10 degrees and a second incident angle of greater than about 30 degrees, and for the second wavelength, an optical transmission of less than about 15% for the first incident angle and of greater than about 30% for the second incident angle.

Disclosed is a wavefront sensor for measuring a tilt of a wavefront at an array of locations across a beam of radiation, wherein said wavefront sensor comprises a film, for example of Zirconium, having an indent array comprising an indent at each of said array of locations, such that each indent of the indent array is operable to perform focusing of said radiation. Also disclosed is a radiation source and inspection apparatus comprising such a wavefront sensor.

An image capture device includes a plurality of independently formed camera channels. Each of the plurality of independently formed camera channels includes a respective sensor, wherein the respective sensor includes circuitry that controls an integration time of the respective sensor, and a respective lens that receives incident light and transmits the incident light to the respective sensor without transmitting the incident light to respective sensor of other camera channels within the plurality of independently formed camera channels. Further, a processor that is communicatively coupled to the respective sensor of each of the plurality of independently formed camera channels. The processor is configured to receive respective images from the respective sensor of each of the plurality of independently formed camera channels, and form a combined image by combing each of the respective images.

According to an aspect, a detection device includes: a substrate that has a detection region; a plurality of photodiodes provided in the detection region; a plurality of lenses provided so as to overlap the respective photodiodes; and a plurality of dummy lenses that are provided in a peripheral region between an outer perimeter of the detection region and edges of the substrate and are provided so as not to overlap the photodiodes.

An imaging device according to the present invention includes an illumination unit 20 containing a light source 21 for emitting illumination light 2, and a lens group 22 for irradiating an imaging object 1 with the illumination light 2 emitted from the light source 21, and an imaging unit 10 for imaging the imaging object 1. A part of the illumination light 2 is shielded by a light shielding component 40.

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

A moisture-resistant optical device comprises a microlens array (MLA) formed from a first material defining a plurality of associated recesses; and a moisture-resisting layer of a second material, formed on the MLA and filling the associated recesses. An associated method of manufacture is also disclosed.