A mirror element, in particular for a microlithographic projection exposure apparatus. According to one aspect, the mirror element includes a substrate (111, 112, 113, 114, 115, 211, 212, 213, 311a-311m, 411, 412, 413) and a layer stack (121, 122, 123, 124, 125, 221, 222, 223, 321a-321m, 421, 422, 423) on the substrate. The layer stack has at least one reflection layer system, wherein a curvature of the mirror element is generated on the basis of a setpoint curvature for a predetermined operating temperature by a non-vanishing bending force exerted by the layer stack, wherein the generated curvature varies by no more than 10% over a temperature interval (T) of at least 10 K.

A light scanning apparatus, including: a light source; a deflection unit configured to deflect a light beam emitted from the light source; a reflecting mirror configured to reflect the light beam to a photosensitive member; a housing; a first support portion provided in the housing to support one end of the reflecting mirror; a second support portion provided in the housing to support the other end of the reflecting mirror; a first leaf spring configured to press the reflecting mirror at the one end to apply an urging force for urging the reflecting mirror against the first support portion; and a second leaf spring configured to press the reflecting mirror at the other end to apply an urging force for urging the reflecting mirror against the second support portion, wherein a pressing force of the first leaf spring is larger than a pressing force of the second leaf spring.

A method for making an optic that is operable in extreme temperature environments, including selecting a material for each of a plurality of mirror panels based on one or more parameters, selecting a type of assembly of an optic, selecting a geometric configuration for each of the plurality of mirror panels, aligning optically each of the plurality of mirror panels, and assembling each of the plurality of mirror panels in optical alignment such that each mirror panel is within a predetermined angular tolerance. The assembling can include fusing the material of at least one of the plurality of mirror panels to make the optic of the selected type of assembly.

An actuator includes a swing portion swingable about a first axis orthogonal to a central axis extending vertically and about a second axis orthogonal to the first axis and intersecting the central axis. An angle detector includes a pair of first angle detection elements above a non-magnetic structure and extending in the second axis direction with the first axis interposed therebetween when viewed from the central axis direction, and a pair of second angle detection elements extending in the first axis direction with the second axis interposed therebetween. Each of the first angle detection elements and each of the second angle detection elements include a columnar magnetic structure between the swing portion and the non-magnetic structure in the central axis direction, and a detection coil along the outer periphery of the magnetic structure.

An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.

A DMD cooling apparatus and method includes a DMD chip configured on a substrate, and a heatsink located within and integrated into the substrate upon which the DMD is configured. A plurality of micro-channels can be formed on a backside of the substrate. The micro-channels are fabricated via microlithography in association with a fabrication of the DMD chip such that the heatsink integrated into the silicon substrate allows for direct heat removal from the substrate.

A linkage rod including a limited-displacement flexible mechanism has structural robustness and allows easy reduction in weight and size, simple production and easy operation. The linkage rod including at least one limited-displacement flexible mechanism, wherein the limited-displacement flexible mechanism comprises at least one limited-displacement flexible joint which comprises: a flexible member; and at least one bend limitation section which is arranged in parallel with the flexible member so that the bend limitation section limits a bend of the flexible member.

A projector device and a heat dissipation system thereof are provided. The heat dissipation system includes a heat dissipating target chip and a heat dissipating module. The heat dissipating target chip has a bottom surface having a heat dissipating area. The heat dissipating module has a heat dissipating body and a heat passage. The heat dissipating body includes a connection end facing the bottom surface, and the heat passage extends out from the connection end and is heat exchange connected to the heat dissipating area. The heat passage has a first cross-section and a second cross-section, wherein the second cross-section is farther away to the heat dissipating area than the first cross-section. The second cross-section area is larger than the first cross-section area.

A cooling control system and method comprise a power meter for measuring a power of a laser, a temperature controller configured to adjust a temperature of fluid circulating through a cooling block, and a chip connected to the cooling block wherein the temperature controller regulates said temperature of the coolant in order to prevent the chip from overheating or from developing condensation on the chip.

A method for producing a mirror arrangement for a lithography apparatus is proposed, which comprises the following steps: producing a mirror body having a cavity delimited by a front wall, a rear wall and a side wall of the mirror body, the side wall being arranged between the front wall and the rear wall, wherein at least one supporting element is provided in the cavity between the front wall and the rear wall; and after producing the mirror body, at least partly removing the supporting element.