A light scanning apparatus, including: a light source; a deflector having a rotary polygon mirror configured to deflect the light beam emitted from the light source, and a motor configured to rotate the polygon mirror; a plurality of reflecting mirrors configured to reflect the light beam to the photosensitive member; and an optical box on which the light source is mounted, wherein the optical box has an installation wall on which the deflector is installed and a support wall positioned on a side of the photosensitive member with respect to the polygon mirror, the support wall being provided with a support portion configured to support at least one reflecting mirror, a stepped portion having a plurality of steps is formed between the installation wall and the support wall, and a back surface of the stepped portion has a shape following an inside surface of the stepped portion.

A chuck interface that includes a mirror; an inner surface that is shaped and sized to match a portion of a sidewall of a chuck; wherein the inner surface is mechanically coupled to the mirror; and at least one interfacing element for assisting in attaching the chuck to the mirror; and wherein a difference between a thermal expansion coefficient of the chuck and a thermal expansion coefficient of the mirror does not exceed 0.5 micron*Kelvin per Meter.

A spectrometer for examining the spectrum of an optical emission source may include: an optical base body, a light entry aperture connected to the optical base body to couple light into the spectrometer, at least one dispersion element to receive the light as a beam of rays and generate a spectrum, and at least one detector for measuring the generated spectrum. A light path may run from the light entry aperture to the detector. A mirror group with at least two mirrors may be provided in a section of the light path between the light entry aperture and the at least one detector, in which the beam does not run parallel, which may compensate for temperature effects. In the mirror group, at least one mirror or the entire mirror group may be moveable relative to the optical base body and may be coupled to a temperature-controlled drive.

A method for compensating for a wavelength shift in a wavelength selective switch (WSS), and a device therefor. The device comprises a fixed seat (301) as well as a rotation beam (304) and a compensation block (302) that have different thermal expansion amounts, the rotation beam (304) and the compensation block (302) being fixedly adhered to the fixed seat (301). In the method, a combined structure of the rotation beam (304) and the compensation block (302) with different thermal expansion amounts is adopted; the combined structure rotates by means of different expansion amounts generated by the rotation beam (304) and the compensation block (302) at the same external temperature, and further drives an optical element of the WSS to rotate, hence compensating for a wavelength shift of the WSS. The method is safe and reliable; the device has a simple structure, and is convenient to encapsulate, is applicable to various WSS optical paths, and does not affect advantages of the optical path structure of the WSS.

An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m.sup.−1 K.sup.−1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m.sup.−1 K.sup.−1.

A wavelength conversion device, a manufacturing method thereof, and a related illumination device. The wavelength conversion device comprises a fluorescent powder layer (110) that is successively stacked, a diffuse reflection layer (120), and a high-thermal-conductivity substrate (130). The diffuse reflection layer (120) comprises white scattered particles for scattering the incident light; the high-thermal-conductivity substrate (130) is one of an aluminum nitride substrate, a silicon nitride substrate, a silicon carbide substrate, a boron nitride substrate, and a beryllium oxide substrate. The wavelength conversion device has good reflectivity and thermal stability.

An apparatus having an optical structure and ridges is described, wherein adhesive is arranged between the ridges and the optical structure, wherein the adhesive is effective to effect, after its annealing, a predetermined orientation of the optical structure in relation to a reference plane.

An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m.sup.−1 K.sup.−1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m.sup.−1 K.sup.−1.

An optical module includes a light-forming unit configured to form light, and a protective member surrounding and sealing the light-forming unit. The light-forming unit includes a laser diode, a first MEMS including a first mirror having a first reflective surface that reflects and scans light from the laser diode, the first mirror oscillating to form a first plane, and a second MEMS including a second mirror having a second reflective surface that reflects and scans light from the first mirror, the second mirror oscillating to form a second plane orthogonal to the first plane.

Apparatus and methods for forming MEMS structures that minimize bending with temperature change due to differences in the coefficient of thermal expansion for different layers of the MEMS structures. In particular, shown is forming a compensating reflectivity coating on the underside of a suspended MEMS structure to offset bending by a reflectivity coating on a top side of the suspended MEMS structure. The reflectivity coating can be either a reflective coating, or a non-reflective (anti-reflective) coating. The method includes forming a cavity on a first wafer, forming the compensating reflective coating on a second wafer substrate that will become the suspended MEMS structure, then flipping the second wafer over and bonding the two wafers together.