An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.

A light control film is described comprising alternating transmissive regions and absorptive regions disposed between the light input surface and the light output surface. The absorptive regions have an aspect ratio of at least 30. In some embodiments, an absorptive layer or reflective layer is disposed between the alternating transmissive regions and absorptive regions and the light input surface and/or light output surface. In another embodiment, the alternating transmissive regions comprise an absorptive material. The light control film can exhibit low transmission of visible light and high transmission of near infrared light. Also described is a light detection system comprising such light control films and a microstructured film.

The invention relates to an image generating device (20) comprising:—at least one light source (23),—a screen (21) designed to be backlit by said light source, and—a reflector (25) arranged between said light source and screen and designed to reflect at least some of the light emitted by the light source. According to the invention, the reflector defines a housing (280) designed to receive the screen such that the reflector has a zone (290) of thermal contact with the screen. The invention also relates to a head-up display comprising an image generating device of this type.

An optical device includes a light-emitting element; an electronic circuit chip; a substrate on which the light-emitting element and the electronic circuit chip are mounted; a first electrode formed on a first mounting surface of the light-emitting element on the substrate; and a second electrode formed on a second mounting surface of the electronic circuit chip on the substrate. The first electrode and the second electrode have the same structure.

The invention is related to a back-light device. The back-light device comprises a reflection structure and a back-light plate. A plurality of light-emitting elements, disposed on the back-light plate, face a light-entering side of the reflection structure, and the emitted light of the light-emitting elements enters the light-entering side of the reflection structure and is reflected to a light-emitting side of the reflection structure by the reflection of the reflection structure for forming a back-light source emitted to a display panel.

An optical article for illuminating building interiors including a reflective grid panel, an LED light source positioned above the reflective grid panel and configured to illuminate the reflective grid panel at incidence angles ranging from a minimum angle of 0° to a maximum angle of at least 45°, a light diffusing sheet of an optically transmissive dielectric material approximately coextensive with and oriented generally parallel to the reflective grid panel, and a pair of reflective side walls flanking a space between the reflective grid panel and the light diffusing sheet. The reflective grid panel incorporates a plurality of parallel longitudinal walls and a plurality of parallel transverse walls joining the walls and defining a plurality of rectangular openings configured to transmit light. Each of the parallel transverse walls extends transversely with respect to a plane of the reflective panel and is configured to diffusely reflect a portion of the light being transmitted through the plurality of rectangular openings.

The disclosure describes various aspects of using optical elements monolithically integrated with light-emitting diode (LED) structures. In an aspect, a light emitting device includes a single LED structure having an active region and a single optical element disposed on the LED structure and configured to collimate and steer light emitted by the LED structure. One or more additional optical elements may also be disposed on the LED structure. In another aspect, a light emitting device may include multiple LED structures and a single optical element disposed on the multiple LED structures and configured to collimate and steer light emitted by the multiple LED structures. For each of these aspects, the LED structure(s) and the optical element(s) are made of a material that includes GaN, the LED structure(s) has a corresponding active region, and the LED structure(s) has a corresponding reflective contact disposed opposite to the optical element(s).

An illumination system, including a light source module and a light uniformizing element, is provided. The light source module provides an illumination light beam. The light uniformizing element has a light incident surface and a light exit surface opposite to the light incident surface, and includes at least one light splitting surface. The light splitting surface is located inside the light uniformizing element. A normal vector of the light splitting surface is perpendicular to a central axis of the light uniformizing element. The illumination light beam is incident to the light incident surface of the light uniformizing element at an oblique angle, and the illumination light beam is split multiple times by the light splitting surface, so that the light uniformizing element outputs a uniformized illumination light beam at the light exit surface. A projection device and a light uniformizing element are also provided.

An illumination system includes a light source module, a first lens array, a condensing element, a second lens array, and a prism element. The light source module is configured to provide an illumination beam. The first lens array is disposed on the transmission path of the illumination beam. The condensing element is disposed on the transmission path of the illumination beam. The first lens array is located between the light source module and the condensing element. The second lens array is disposed on the transmission path of the illumination beam. The prism element is disposed on the transmission path of the illumination beam. The second lens array is located between the condensing element and the prism element, wherein the surface area of the second lens array is greater than the surface area of the first lens array.

The optical assembly disclosed in the embodiment includes a housing having an inclined bottom surface, a plurality of inner surfaces around an outer periphery of the bottom surface, and a receiving space in which an upper portion is opened; and a lighting module disposed on the inclined bottom surface, wherein the lighting module includes a substrate inclinedly disposed on the inclined bottom surface; at least one light emitting device disposed on the substrate; and a resin layer sealing the light emitting device and the substrate, wherein an upper surface of the resin layer emits light by diffusing light emitted from the light emitting device, wherein the plurality of inner surfaces includes a first inner surface adjacent to the light emitting device, a second inner surface facing the first inner surface, and third and fourth inner surfaces facing each other and disposed between the first and second inner surfaces, wherein a height between the bottom surface of the housing and an upper surface of the housing increases from the first inner surface toward the second inner surface, and decreases from the third inner surface toward the fourth inner surface.