Optical read-out of a cryogenic device (such as a superconducting logic or detector element) can be performed with a forward-biased optical modulator that is directly coupled to the cryogenic device without any intervening electrical amplifier. Forward-biasing at cryogenic temperatures enables very high modulation efficiency (1,000-10,000 pm/V) of the optical modulator, and allows for optical modulation with millivolt driving signals and microwatt power dissipation in the cryogenic environment. Modulated optical signals can be coupled out of the cryostat via an optical fiber, reducing the thermal load on the cryostat. Using optical fiber instead of electrical wires can increase the communication bandwidth between the cryogenic environment and room-temperature environment to bandwidth densities as high as Tbps/mm.sup.2 using wavelength division multiplexing. Sensitive optical signals having higher robustness to noise and crosstalk, because of their immunity to electromagnetic interference, can be carried by the optical fiber.

In an optical waveguide element which uses a rib type optical waveguide, light propagating in the rib type optical waveguide is monitored stably and accurately. The optical waveguide element includes a rib type optical waveguide provided on a optical waveguide substrate and configured of a convex portion protruding in a thickness direction of the optical waveguide substrate and extending in a plane direction of the optical waveguide substrate, and a light receiving element configured of a light receiving part formed on a light receiving element substrate disposed on the rib type optical waveguide and configured to receive at least a part of light propagating through the rib type optical waveguide, and the light receiving element substrate is supported by at least one first convex portion having the same height as that of the rib type optical waveguide provided on the optical waveguide substrate.

To provide an optical modulation element capable of suppressing electrode loss at a low frequency of 50 GHz or less, and suppressing radiation loss at a high frequency of 50 GHz or more. An optical modulation element comprises: a substrate; and at least one interaction part provided on the substrate. The interaction part includes: first and second optical waveguides formed adjacent to each other on the substrate; and first and second signal electrodes provided so as to oppose the first and second optical waveguides respectively. o ground electrode is provided in a nearby region of the interaction part, and a ground electrode is provided in the vicinity of at least one of an input part and a terminal part electrically connected to each of the first and second signal electrodes.

To provide an optical modulation element whereby reduced drive voltage and suppression of DC drift can be obtained at the same time. An optical modulation element includes: a substrate; and an optical waveguide formed of an electrooptic material film formed on the substrate and having a ridge part which is a protruding portion, and a slab part having a smaller film thickness than the ridge part 11r. The optical waveguide includes a first waveguide part having a first ridge width and a first slab film thickness and to which an RF signal is applied, and a second waveguide part having a second ridge width and a second slab film thickness different from the first slab film thickness and to which a DC bias is applied.

An apparatus includes a lithium niobate (LN) layer, and a planar electro-optical modulator having at least one hybrid optical core segment formed of a portion of the LN layer and an optical guiding rib. The optical guiding rib may be located in a top silicon layer of a silicon photonics (SiP) chip, to which a thin-film LN chip is flip-chip mounted, and may be coupled to optical waveguide cores in a first silicon core layer of the SiP chip. One or more drive electrodes are disposed between a substrate of the SiP chip and the LN layer. In some embodiments hybrid optical core segments may include silicon nitride core segments and may form an MZM configured to be differentially or dual-differentially driven.

An optical circuit of the present disclosure shares at least a part of an electrical path including phase variable means between neighboring optical interference circuits, or configures an electrical path so as to straddle neighboring optical interference circuits, thereby performing electrical or thermal feedback. The optical circuit includes a mechanism using the electrical or thermal feedback for cancelling components of thermal crosstalk from one optical interference circuit to another neighboring optical interference circuit. The optical circuit of the present disclosure has a resistor element that shares electrical paths including respective phase variable means between the neighboring optical interference circuits. The optical circuit changes the phase change amount by the phase variable means in the neighboring optical interference circuit, in such a way as to cancel the thermal crosstalk components by the resistor element.

An optical device includes an optical waveguide that is a rib type and that is formed of a thin film lithium niobate (LiNbO.sub.3: LN) substrate using a thin film LN crystal, and a buffer layer that is laminated on the optical waveguide. Furthermore, the optical device includes an electrode that is laminated on the buffer layer and that applies a voltage to the optical waveguide, and a gettering site that is disposed parallel to the optical waveguide and that traps an electric charge inside the optical waveguide.

The light modulator includes a substrate having a main surface including a first area, a second area, and a third area, a first III-V compound semiconductor layer of a first conductivity-type provided on the first area, a second III-V compound semiconductor layer of a first conductivity-type or a second conductivity-type provided on the second area, a core provided on the third area and including a group III-V compound semiconductor, and an electrode connected to the first III-V compound semiconductor layer. The first III-V compound semiconductor layer includes a first portion having a thickness smaller than a thickness of the core in a second direction orthogonal to the main surface and a second portion having a thickness larger than the thickness of the first portion in the second direction. The second portion is disposed between the first portion and the core.

Various embodiments include an electrical device comprising an antiferromagnetic topological insulator having a surface comprising a bulk domain wall configured to support a first type of 1D chiral channel, a surface step configured to support a second 1D chiral channel and intersecting the bulk domain wall to form thereat a quantum point junction.

Various embodiments of a monolithic transceiver are described, which may be fabricated on a semiconductor substrate. The monolithic transceiver includes a coherent receiver module (CRM), a coherent transmitter module (CTM), and a local oscillation splitter to feed a local oscillation to the CRM and the CTM with a tunable power ratio. The monolithic transceiver provides tunable responsivity by employing photodiodes for opto-electrical conversion. The monolithic transceiver also employs a polarization beam rotator-splitter (PBRS) and a polarization beam rotator-combiner (PBRC) for supporting modulation schemes including polarization multiplexed quadrature amplitude modulation (PM-QAM) and polarization multiplexed quadrature phase shift keying (PM-QPSK).