Various embodiments of a monolithic electro-optical (E-O) modulator are described. The monolithic E-O modulator includes an active region comprising a plurality of p-n junction diodes, as well as a modulation electrode and a bias electrode that extend through the active region. The monolithic E-O modulator further includes a resistor-capacitor-bias-capacitor (RCBC) electrode structure configured to receive an electrical modulation signal, a direct-current (DC) bias voltage and a power supply voltage. Specifically, the RCBC electrode structure includes a resistor coupled to the modulation electrode and two capacitors each coupled to a respective end of the bias electrode. Beneficially, the RCBC electrode structure enables the p-n junction diodes to be biased independently from a DC level of the electrical modulation signal.

Methods of manufacturing and using a monolithically integrated optical phase array (OPA) chip device, and the device itself. A three-dimensional (3-D) integrated optical phase array (OPA) chip device. A method of manufacturing a two-dimensional sparse optical phase array by layout-constrained array factor optimization. A system of complementary metal-oxide-semiconductor (CMOS) electronics integrated with a three-dimensional integrated optical array chip device. A method of three-dimension vertical coupling to improve optical power in optical phase arrays.

Structures for an electro-optic modulator and methods of fabricating a structure for an electro-optic modulator. The electro-optic modulator has a layer stack arranged over a section of a waveguide core. The layer stack includes a first layer, a second layer, and a third layer. The first layer, the second layer, and the third layer are each composed of either copper or indium-tin oxide.

A silicon modulator where the doping profile varies along the lateral and/or longitudinal position in the transition zones to achieve improved performance in terms of either optical attenuation or contact access resistance or both. A silicon-based modulator includes a waveguide core that is a PN junction region; a first transition zone that is a P-side region adjacent to the waveguide core and a first electrode; and a second transition zone that is an N-side region adjacent to the waveguide core on an opposite side as the first transition region and a second electrode; wherein a thickness of each of the first transition zone and the second transition zone is variable in any of a lateral direction, a longitudinal direction, and both the lateral direction and the longitudinal direction, each of the lateral direction and the longitudinal direction are relative to the waveguide core.

An electro-absorption optical modulator capable of realizing optical coupling with a Si waveguide with high efficiency, improving modulation efficiency, reducing light absorption by an electrode layer and achieving low optical loss includes a substrate; a first silicon layer doped to exhibit a first type of conductivity and a second silicon layer doped to exhibit a second type of conductivity that are disposed parallel to the substrate; and a Ge.sub.1−xSi.sub.x (0<x<1)/Si stack in which a Ge.sub.1−xSi.sub.x layer and a Si layer are stacked on the first and second silicon layers in this order.

A semiconductor device includes a first insulating layer, an optical waveguide formed on the first insulating layer, a fixed charge layer formed on the first insulating layer such that the fixed charge layer covers the optical waveguide, and a second insulating layer formed on the fixed charge layer.

A display device includes a pixel connected to a data line, a data pad connected to the data line, and a first test area. The first test area includes a test control line transmiting a test control signal, a test signal line transmitting a test signal, and a first switch connected to the data pad. The first switch includes a gate electrode connected to the test control line, first and second semiconductor layers overlapping the gate electrode, a source electrode connected to the first and second semiconductor layers, and a drain electrode spaced from the source electrode and connected to the first and second semiconductor layers. The source electrode and the drain electrode are connected to the test signal line and data pad, respectively. One of the first or second semiconductor layers includes an oxide semiconductor and the other of the first or second semiconductor layer includes a silicon-based semiconductor.

An integrated optical modulator array useful for modulating light at different wavelengths in the same optical band includes multiple GeSi waveguides on a substrate. Each GeSi waveguide has a different width and is coupled to electrodes to form an electro-absorption modulator. A stressor material, such as SiN, disposed between the GeSi waveguides in the optical modulators applies a strain to the GeSi waveguides. Because each GeSi waveguide has a different width, it experiences a different strain. This difference can be a difference in magnitude, type (homogeneous v. inhomogeneous, compressive v. tensile), or both. The different strains shift the bandgaps of the Ge in the GeSi waveguides by different amounts, shifting the optical absorption edges for the GeSi waveguides by different amounts. Put differently, the stressor layer strains each GeSi modulator differently, causing each GeSi modulator to operate at a different wavelength.

Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include in an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have fingers of p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide. Contacts may be formed on the fingers of p-doped and n-doped regions. The fingers of p-doped and n-doped regions may be arranged symmetrically about the PN junction waveguide or staggered along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.

An electro-optical phase modulator includes a waveguide made from a stack of strips. The stack includes a first strip made of a doped semiconductor material of a first conductivity type, a second strip made of a conductive material or of a doped semiconductor material of a second conductivity type, and a third strip made of a doped semiconductor material of the first conductivity type. The second strip is separated from the first strip by a first interface layer made of a dielectric material, and the third strip is separated from the second strip by a second interface layer made of a dielectric material.