Embodiments of the present disclosure generally relate to systems and methods for performing photolithography processes. In one embodiment, a photolithography system includes a plurality of image projection systems each having an extendable lens, and a plate having a plurality of openings. Each extendable lens is configured to be extended through a corresponding opening of the plurality of openings during operation. The plate includes one or more elements disposed adjacent each opening and each lens includes one or more elements formed thereon. The one or more elements formed on the plate and the one or more elements formed on the lens are utilized to measure one or more distances between the lens and the plate. Any deviation of the measured distance from a reference distance indicates that the lens has been shifted. Measures to compensate for the shifting of the lens will be performed.

A method forms a pattern of metallic nanofeatures that generates by plasmonic resonance a desired image having a distribution of colors. The method includes providing a substrate having a layer of photosensitive material, exposing the layer to a high-resolution periodic pattern of dose distribution, and determining a low-resolution pattern of dose distribution such that the sum of the low-resolution pattern and the high-resolution periodic pattern of dose distribution is suitable for forming the pattern of metallic nanofeatures. The lateral dimensions of the metallic nano-features have a spatial variation across the pattern that corresponds to the distribution of colors in the desired image. The layer of photosensitive material is exposed to the low-resolution pattern of dose distribution. The layer of photosensitive material is developed to produce a pattern of nanostructures in the developed photosensitive material. The pattern of nanostructures is processed so that the pattern of metallic nanofeatures is formed.

The present disclosure provides a lithography system comprising a radiation source and an exposure tool including a plurality of exposure columns densely packed in a first direction. Each exposure column includes an exposure area configured to pass the radiation source. The system also includes a wafer carrier configured to secure and move one or more wafers along a second direction that is perpendicular to the first direction, so that the one or more wafers are exposed by the exposure tool to form patterns along the second direction. The one or more wafers are covered with resist layer and aligned in the second direction on the wafer carrier.

A maskless exposure device includes an exposure head including a digital micro-mirror device, the digital micro-mirror device being configured to scan an exposure beam to a substrate by reflecting a source beam from an exposure source; and a system control part configured to control the digital micro-mirror device by utilizing a graphic data system file. The graphic data system file includes data for a source electrode, a drain electrode and a channel portion between the source electrode and the drain electrode in a plan view. The channel portion includes a first portion extending in a direction perpendicular to a scan direction of the exposure head. A width of the first portion of the channel portion is defined to be a multiple of a pulse event generation of the exposure beam.

The present invention provides a lithography apparatus which forms a pattern on a substrate, the apparatus including an optical unit including a plurality of optical systems each of which irradiates the substrate with a beam for forming the pattern and which are arranged in at least one of a first direction and a second direction orthogonal to an optical axis thereof, and a pair of interferometers configured to measure a rotation angle of the optical unit around an axis parallel to the optical axis, wherein a distance between measurement axes of the pair of interferometers is not small than longer one of a distance between optical axes of two optical systems, of the plurality of optical systems, farthest away from each other in the first direction and a distance between optical axes of two optical systems, of the plurality of optical systems, farthest away from each other in the second direction.

A maskless exposure device includes a plurality of exposure heads, each exposure head including a digital micro-mirror device configured to scan an exposure beam to a substrate, the exposure heads being disposed in staggered first and second rows, a plurality of reflecting members disposed on side surfaces of the exposure heads and having reflecting surfaces parallel with each other, a light emitting part configured to light to the reflecting members, and a light receiving part configured to receive light via the reflecting members.