In an embodiment, a photomask includes: a substrate over a first conductive layer, the substrate formed of a low thermal expansion material (LTEM); a second conductive layer over the first conductive layer; a reflective film stack over the substrate; a capping layer over the reflective film stack; an absorption layer over the capping layer; and an antireflection (ARC) layer over the absorption layer, where the ARC layer and the absorption layer have a plurality of openings in a first region exposing the capping layer, where the ARC layer, the absorption layer, the capping layer, and the reflective film stack have a trench in a second region exposing the second conductive layer.

The present disclosure provides a photoetching mask plate, a method for manufacturing the photoetching mask plate, and a photoetching method using the photoetching mask plate. The photoetching mask plate includes a base substrate, a mask pattern arranged on a surface of the base substrate, and a conductive connection pattern arranged on the surface of the base substrate. The conductive connection pattern is configured to electrically connect separate portions of the mask pattern to each other.

The present disclosure provides a photoetching mask plate, a method for manufacturing the photoetching mask plate, and a photoetching method using the photoetching mask plate. The photoetching mask plate includes a base substrate, a mask pattern arranged on a surface of the base substrate, and a conductive connection pattern arranged on the surface of the base substrate. The conductive connection pattern is configured to electrically connect separate portions of the mask pattern to each other.

A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.

A method of lithography process is provided. The method includes forming a conductive layer over a reticle. The method includes applying ionized particles to the reticle by a discharging device. The method includes forming a photoresist layer over a semiconductor substrate. The method includes securing the semiconductor substrate by a wafer electrostatic-clamp. The method also includes patterning the photoresist layer by emitting radiation from a radiation source via the reticle.

A photomask is provided. The photomask comprises: a low thermal expansion material (LTEM) substrate including a first surface and a second surface; a reflective layer disposed on the first surface of the low thermal expansion material substrate and including first material layers and second material layers, which are stacked alternately; a light absorbing pattern on the reflective layer; and a conductive layer on the second surface of the low thermal expansion material substrate, wherein the low thermal expansion material substrate includes a correction defect correcting the light absorbing pattern, and the conductive layer is one of ruthenium oxide (RuO.sub.2), iridium oxide (IrO.sub.2), and/or a combination thereof.

A reflective mask blank for EUV lithography, includes: a substrate; a conductive film; a reflective layer; and an absorption layer, the absorption layer absorbing the EUV light, wherein the conductive film has a refractive index n.sub.?1000-1100 nm of 5.300 or less and has an extinction coefficient k.sub.?1000-1100 nm of 5.200 or less, at a wavelength of 1000 nm to 1100 nm, the conductive film has a refractive index n.sub.?600-700 nm of 4.300 or less and has an extinction coefficient k.sub.?600-700 nm of 4.500 or less, at a wavelength of 600 nm to 700 nm, the conductive film has a refractive index n.sub.?400-500 nm of 2.500 or more and has an extinction coefficient k.sub.?400-500 nm of 0.440 or more, at a wavelength of 400 nm to 500 nm, and the conductive film has a film thickness t of 40 nm to 350 nm.

A reticle, a reticle container and a method for discharging static charges accumulated on a reticle are provided. The reticle includes a mask substrate, a reflective multilayer (ML) structure, a capping layer, an absorption structure and a conductive material structure. The mask substrate has a front-side surface and a back-side surface. The reflective ML structure is positioned over the front-side surface of mask substrate. The capping layer is positioned over the reflective ML structure. The absorption structure is positioned over the capping layer. The conductive material structure is positioned over a sidewall surface of the mask substrate and a sidewall surface of the absorption structure.

A photo mask includes a transparent substrate, a transflective member, and a light shielding member. The transparent substrate has a transflective region including a first region, a second region located in opposing lateral portions of the first region, and an edge region located adjacent to the first and second regions, and a light shielding region surrounding the transflective region. The transflective member is disposed in the first, second and edge regions under the transparent substrate, and has a different light transmittance in each of the first, second and edge regions. The light shielding member is disposed in the light shielding region under the transparent substrate, and defines an opening which exposes the transflective region. The light shielding member includes a long side extending in a first direction parallel to an upper surface of the transparent substrate and a short side extending in a second direction.

The present disclosure provides a photoetching mask plate, a method for manufacturing the photoetching mask plate, and a photoetching method using the photoetching mask plate. The photoetching mask plate includes a base substrate, a mask pattern arranged on a surface of the base substrate, and a conductive connection pattern arranged on the surface of the base substrate. The conductive connection pattern is configured to electrically connect separate portions of the mask pattern to each other.