A pellicle is proposed in which a mask-bonding agglutinant layer, that bonds the pellicle to a photomask, is divided into segments, and the vacancies thus created between these segments are entirely occupied by segments of a non-resilient body layer, and these alternately arranged segments are flush with each other.

A pellicle is proposed in which a mask-bonding agglutinant layer, that bonds the pellicle to a photomask, is divided into segments, and the vacancies thus created between these segments are entirely occupied by segments of a non-resilient body layer, and these alternately arranged segments are flush with each other.

A method for manufacturing a membrane assembly for EUV lithography, the method including: providing a stack including: at least one membrane layer supported by a planar substrate, wherein the planar substrate has an inner region and a border region around the inner region; and a first sacrificial layer between the planar substrate and the membrane layer; selectively removing the inner region of the planar substrate such that the membrane assembly has: a membrane formed from the at least one membrane layer, and a border holding the membrane, the border having the border region of the planar substrate and the first sacrificial layer situated between the border region and the membrane layer, wherein the selectively removing the inner region of the planar substrate includes using an etchant which has a similar etch rate for the membrane layer and its oxide and a substantially different etch rate for the first sacrificial layer.

A method for manufacturing a membrane assembly for EUV lithography, the method including: providing a stack including: at least one membrane layer supported by a planar substrate, wherein the planar substrate has an inner region and a border region around the inner region; and a first sacrificial layer between the planar substrate and the membrane layer; selectively removing the inner region of the planar substrate such that the membrane assembly has: a membrane formed from the at least one membrane layer, and a border holding the membrane, the border having the border region of the planar substrate and the first sacrificial layer situated between the border region and the membrane layer, wherein the selectively removing the inner region of the planar substrate includes using an etchant which has a similar etch rate for the membrane layer and its oxide and a substantially different etch rate for the first sacrificial layer.

The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame attached to the pellicle membrane. The pellicle frame has a surface that defines at least one groove. The apparatus further includes a substrate that is in contact with the surface of the pellicle frame such that the grove is positioned between the pellicle frame and the substrate.

The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame attached to the pellicle membrane. The pellicle frame has a surface that defines at least one groove. The apparatus further includes a substrate that is in contact with the surface of the pellicle frame such that the grove is positioned between the pellicle frame and the substrate.

A method of manufacturing a pellicle membrane, the method including: providing a first sacrificial layer on a planar substrate to form a stack; and providing, to at least a portion of the stack, at least one metal silicide or doped metal silicide pellicle core layer which forms at least part of the pellicle membrane is described. Also described is a pellicle membrane assembly having a substrate, a first sacrificial layer, and at least one metal silicide or doped metal silicide pellicle layer which forms at least part of a pellicle core, as well as a lithography apparatus including such a pellicle.

A method of manufacturing a pellicle membrane, the method including: providing a first sacrificial layer on a planar substrate to form a stack; and providing, to at least a portion of the stack, at least one metal silicide or doped metal silicide pellicle core layer which forms at least part of the pellicle membrane is described. Also described is a pellicle membrane assembly having a substrate, a first sacrificial layer, and at least one metal silicide or doped metal silicide pellicle layer which forms at least part of a pellicle core, as well as a lithography apparatus including such a pellicle.

A photomask protection device, a photomask protection system, and a use method of a photomask protection system are provided. The photomask protection device includes a frame and a pellicle. The frame is disposed on a substrate of a photomask and is provided with a clamping space. Edges of the pellicle are fixed in the clamping space.

A pellicle having a metal oxysilicide layer. A pellicle having a molybdenum layer, a ruthenium layer and a silicon oxynitride layer, wherein the molybdenum layer is disposed between the ruthenium layer and the silicon oxynitride layer. A method of manufacturing a pellicle for a lithographic apparatus, the method including providing a metal oxysilicide layer. A lithographic assembly including a pellicle having a metal oxysilicide layer. The use of a pellicle having a metal oxysilicide layer in a lithographic apparatus.