Provided are a photosensitive composition including a coloring material, a resin, a polymerizable compound, a photopolymerization initiator, and a solvent A, in which the solvent A includes a solvent A1 in which a surface tension at 25° C. is 28.0 mN/m or more, a viscosity at 25° C. is 5.0 mP.Math.s or less, and a boiling point is 160° C. or higher, and a content of the solvent A1 in a total amount of the solvent A is 15% by mass or more; a method for forming a pixel formed of the photosensitive composition; a method for manufacturing an optical filter; a method for manufacturing a solid-state imaging element; and a method for manufacturing an image display device.

The present application provides a backplane unit, a manufacturing method thereof, and a display device. The manufacturing method includes the following steps: forming a photoresist layer on an array substrate; performing exposure on at least a portion of the photoresist layer corresponding to a light-emitting element; forming a light-shielding layer on at least a side of the photoresist layer away from the array substrate, wherein the light-shielding layer exposes at least a side portion of the light-emitting element; and laterally stripping the photoresist layer on the light-emitting element with a stripping solution to obtain the backplane unit.

Provided are a coloring composition including a colorant including a yellow colorant, a resin, and a solvent, in which a content of the yellow colorant in the colorant is 30% by mass or more, and the yellow colorant includes 15% by mass or more of an azomethine metal complex; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A photosensitive resin composition is provided. The photosensitive resin composition is applied in a technical field of flexible display devices. The photosensitive resin composition comprises 5 to 50 parts by weight of an acrylate crosslink monomer, 0.2 to 0.6 parts by weight of an initiator, 5 to 8 parts by weight of a liquid pigment solid substance, 5 to 8 parts by weight of a resin, and 20 to 70 parts by weight of a solvent. The initiator is a radical initiator having a decomposition temperature less than 40° C. The acrylate crosslink monomer comprises a copolymerization two of aromatic group-containing and triol-containing acrylate polymerizable monomers for lowering a temperature of a following color filter preparing process. A method of preparing the photosensitive resin composition and a display device comprising the photosensitive resin composition are also provided.

The present invention provides a curable compound including a pigment, a compound A, a photopolymerization initiator, a curable compound other than the compound A, and a resin, in which a content of the compound A in a total solid content of the curable composition is 1 to 15 mass %. The compound A is a compound having each of a coloring agent partial structure, an acid group or a basic group, and a curable group. The present invention further provides a method for producing the curable composition, a film formed of the curable composition, a color filter, a method for manufacturing a color filter, a solid-state imaging element, and an image display device.

The disclosure provides a polyimide (PI) substrate and a manufacturing method thereof. The PI substrate includes a first area and a plurality of second areas, wherein the second areas are spaced apart from each other in the first area, and the PI substrate includes a glass substrate and a plurality of PI layers disposed on the glass substrate.

A composition includes a near infrared absorbing pigment and a solvent, in which the near infrared absorbing pigment is at least one selected from a colorant compound which has a cation and an anion in the same molecule, a colorant compound which is a salt of a cationic chromophore and a counter anion, and a colorant compound which is a salt of an anionic chromophore and a counter cation, a D50 particle size in which a cumulative volume in a particle size distribution of particle sizes of the near infrared absorbing pigment is 50% is 100 nm or lower, and d values of Hansen solubility parameters of the near infrared absorbing pigment and the solvent satisfy a predetermined expression.

The present invention provides a manufacturing method of a color film substrate and the color film substrate. The manufacturing method includes providing a substrate; forming a first photoresist layer on a first sub-pixel region; forming a quantum dot layer on the substrate, wherein light emission colors of at least two types of quantum dots are respectively different from a light emission color of the first photoresist layer; forming a second photoresist layer and a third photoresist layer on the quantum dot layer in order; and quenching the quantum dot layer to invalidate unshielded quantum dots of the quantum dot layer.

Wire grid polarizer and manufacturing method thereof are provided, the wire grid polarizer includes: substrate; first wire grid formed on substrate, including first wire grid reflection strips arranged parallel to each other and at equal intervals; second wire grid formed at a side of first wire grid away from substrate, including second wire grid reflection strips arranged in parallel to each other and at equal intervals; second wire grid reflection strips are in one-to-one correspondence with first wire grid reflection strips; orthographic projections of second wire grid reflection strip onto substrate falls within orthographic projections of corresponding first wire grid reflection strip onto substrate; wire width of second wire grid reflection strip is less than that of first wire grid reflection strip; and wire spacing of second wire grid reflection strip is greater than that of the first wire grid reflection strip.