A touch sensor includes a touch substrate, a plurality of first touch electrodes extending in a first direction, a plurality of second touch electrodes extending in a second direction crossing the first direction, and a plurality of protrusions on at least one of the plurality of first and second touch electrodes.

A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

According to one embodiment, a pattern formation material is included in a polymer layer to be provided between a block copolymer layer and a substrate. The block copolymer layer includes a block copolymer including a plurality of blocks. The pattern formation material includes a pattern formation polymer. The pattern formation polymer consists of a main chain including an acrylic backbone, and a side chain. One of the plurality of blocks include a plurality of polymer components. The plurality of polymer components are of mutually-different types. A solubility parameter of the pattern formation material is between a maximum value and a minimum value of a solubility parameter of the polymer components.

A method of manufacturing a polarizer includes forming a first layer on a base substrate, forming a first partition wall layer on the first layer, forming a second partition wall layer on the first partition wall, forming a plurality of first partition wall patterns and a plurality of second partition walls disposed on the first partition wall patterns by etching the first partition wall and the second partition wall at the same time, forming a block copolymer layer on the first layer on which the plurality of first partition wall patterns are formed, forming a plurality of fine patterns from the block copolymer layer, and patterning the first layer using the fine patterns and the second partition wall patterns as a mask.

Disclosed is a method for manufacturing a thin film transistor. The method includes steps of etching a second metal layer and a semiconductor layer to form a boundary region of a thin film transistor; etching the second metal layer again to form a source, a drain and a back channel region of the thin film transistor; removing residual photoresist via an ashing procedure; and etching the semiconductor layer again to form a conductive channel of the thin film transistor. According to the method, the electric leakage problem of thin film transistor due to diffusion of copper and contamination of organic stripping liquid can be eliminated.

A conductive layer is formed on the first zone of a carrier. The redistribution layer is formed on the conductive layer on the first zone and the second zone of the carrier. Then an open-test and a short-test are performed to the redistribution layer. Since the conductive layer and the parts of the redistribution layer formed on the conductive layer constitute a closed loop, a load is presented if the redistribution layer is formed correctly. In addition, no load is presented if the redistribution layer is formed correctly since the parts of the redistribution layer formed on the second zone of the carrier constitute an open loop. Therefore, whether the redistribution layer is flawed or not is determined before the dies are boned on the redistribution layer. Thus, no waste of the good die is occurred because of the flawed redistribution layer.

A method comprises applying a composition on a substrate to form a coating film on the substrate. The coating film is heated in an atmosphere in which an oxygen concentration is less than 1% by volume and a temperature is higher than 450 C. and 800 C. or lower, to form a film on the substrate. The composition comprises a compound comprising an aromatic ring. The oxygen concentration in the atmosphere during the heating of the coating film is preferably no greater than 0.1% by volume. The temperature in the atmosphere during the heating of the coating film is preferably 500 C. or higher and 600 C. or lower.

A write head having a main pole, a gap layer, and at least two sacrificial layers. In accordance with one embodiment, a method includes depositing a non-magnetic gap layer of material above a main pole layer of magnetic material; depositing a sacrificial layer of material above the non-magnetic gap layer of material; etching a portion of the sacrificial layer of material while not entirely removing the sacrificial layer of material; and depositing additional sacrificial material to the etched sacrificial layer.

Provided herein is a method, including forming a first template including a first pattern, wherein forming the first template includes self-assembly of diblock copolymers guided by an initial pattern; forming a second template including a second pattern, wherein the second pattern corresponds to a servo pattern; and forming a master template from the first template, wherein the master template includes one or more portions of the first pattern combined with the second pattern.

Provided are a resin composition containing at least one resin selected from the group consisting of a polyimide and a precursor thereof and having a ring structure with 5 or more membered rings in a side chain, a polymerization initiator, and a polymerizable compound; a cured substance; a laminate; a manufacturing method for a cured substance; a manufacturing method for a laminate; a manufacturing method for a semiconductor device; and a semiconductor device.