Compositions including hard magnetic photoresists, soft photoresists, hard magnetic elastomers and soft magnetic elastomers are provided.

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6).

7.5≦(X)≦75  (4)

2.5≦(Y)≦40  (5)

1.5×(Y)≦(X)≦3×(Y)  (6)

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Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator, and a dry film solder resist manufactured therefrom.

A new primer for electroless plating for use in a pretreatment process of electroless plating, is environmentally friendly, can be treated in fewer process steps, and can facilitate formation of fine-pitch wiring with a width of a few μm by photolithography. A photosensitive primer for forming a metal plating film on a base material through an electroless plating process has (a) a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 1,000 to 5,000,000, (b) metal fine particles, (c) a polymerizable compound having three or more (meth)acryloyl groups in a molecule, and (d) a photopolymerization initiator.

The present invention relates to an electron beam (eBeam) resist composition, particularly an (eBeam) resist composition for use in the fabrication of integrated circuits. Such resist compositions include an anti-scattering compound which minimises scattering and secondary electron generation, thus affording extremely high resolution lithography. Such high resolution lithography may be used directly upon silicon-based substrates to produce integrated circuits, or may alternatively be used to produce a lithographic mask (e.g. photomask) to facilitate high-resolution lithography.

To provide a photosensitive composition for hologram recording that enables further improvement in diffraction characteristic. A photosensitive composition for hologram recording that includes at least two kinds of photopolymerizable monomers, a photopolymerization initiator, a binder resin, and a polymerization inhibitor. The at least two kinds of photopolymerizable monomers are a monofunctional monomer and a polyfunctional monomer.

A photosensitive conductive paste that contains(a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a pnotopolym.erization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.

A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

Provided is a resin composition for imprinting excellent in imprint properties and optical properties such as high refractive index and low haze. The invention relates to a resin composition for imprinting containing: (A) a polysiloxane resin represented by the following formula (1): (R.sup.1SiO.sub.3/2).sub.a(R.sup.2.sub.2SiO.sub.2/2).sub.b(R.sup.3.sub.3SiO.sub.1/2).sub.c(SiO.sub.4/2).sub.d wherein R.sup.1, R.sup.2, and R.sup.3 are each independently a hydrogen atom, a hydroxy group, an alkoxy group, a C1-C12 hydrocarbon group, or a C1-C12 substituent having one or more crosslinkable functional groups, with at least one of R.sup.1, R.sup.2, or R.sup.3 being a C1-C12 substituent having one or more crosslinkable functional groups, and when a plurality of R.sup.1s, R.sup.2s, or R.sup.3s are present, they may be different from one another; and a, b, c, and d are numbers satisfying the following conditions: 0.001≤a≤1.00, 0≤b≤0.999, 0≤c≤0.30, 0≤d≤0.30, and a+b+c+d=1.0; and (B) a fine particulate inorganic oxide, wherein the ratio by weight of the sum of the polysiloxane resin (A) and optionally an alkoxysilane compound and a curable resin to the fine particulate inorganic oxide (B) is 0.2 to 2.5.

A photoresist composition includes a radiation-sensitive acid generator, particles, and a first solvent. The radiation-sensitive acid generator is capable of generating an acid upon irradiation with a radioactive ray, an action of the acid allowing a solubility of a film made from the photoresist composition in a developer solution to be altered. The particles include a metal element and have a hydrodynamic radius as determined by a dynamic light scattering analysis of no greater than 20 nm. The photoresist composition may include an acid-labile compound including an acid-labile group. The radiation-sensitive acid generator may be the acid-labile compound including a group that is capable of generating an acid upon exposure to a radioactive ray.