An object of the present invention is to provide a solution which contains an organic solvent as a main component (content: equal to or greater than 98% by mass) and has an excellent defect inhibition ability. Another object of the present invention is to provide a solution storage body storing the solution, an actinic ray-sensitive or radiation-sensitive resin composition containing the solution, and a pattern forming method and a manufacturing method of a semiconductor device using the solution. The solution of the present invention is a solution containing at least one kind of organic solvent having a boiling point lower than 200° C. and an organic impurity having a boiling point equal to or higher than 250° C., in which a content of the organic solvent with respect to a total mass of the solution is equal to or greater than 98% by mass, and a content of the organic impurity with respect to the total mass of the solution is equal to or greater than 0.1 mass ppm and less than 100 mass ppm.

Hydrophobic, tough, photoimageable, functionalized polyimide formulations have been discovered that can be UV cured and developed in cyclopentanone. The present invention formulations can be used as passivation and redistribution layers with patterning provided by photolithograph, for the redistribution of I/O pads on fan-out RDL applications. The curable polyimide formulations reduce stress on thin wafers, when compared to conventional polyimide formulations, and provide low modulus, hydrophobic solder mask. These materials can serve as protective layers in any applications in which a thin, flexible, and hydrophobic polymer is required, that also has high tensile strength and high elongation at break.

Provided is a resist composition which contains a resin (A) and a solvent (B) that contains a compound (B1) represented by general formula (b-1), wherein the content of the active ingredients based on the total amount of the resist composition is 45% by mass or less.

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(In formula (b-1), R.sup.1 represents an alkyl group having from 1 to 10 carbon atoms.)

An organic EL display device including a substrate, and a planarization layer, a first electrode, a pixel division layer, a light emitting pixel and a second electrode formed on the substrate, wherein the planarization layer and/or the pixel division layer contain(s) zirconium nitride particles, and a crystallite size of the zirconium nitride particles determined from a half width of a peak derived from a (111) plane in an X-ray diffraction spectrum using a CuKα ray as an X-ray source is 5 nm or more 20 nm or less. Provided are an organic EL display device with excellent visibility and fewer display defects, and a cured film which is excellent in storage stability of a photosensitive resin composition capable of being applied on an insulating layer of the organic EL display device, and which has high sensitivity and high visible light-shielding property and is also free from residue in the opening.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.

Provided are (1) a composition including an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, a surfactant, and a solvent, in which a surface tension measured by a Wilhelmy method at 25° C. is 26.5 mN/m or less; (2) a composition including a surfactant and a solvent, in which a surface tension T1 measured by a Wilhelmy method at 25° C. and a surface tension T2 measured by a Wilhelmy method at 25° C. immediately before a timing that a volume reaches 60% of an initial volume in an environment of a temperature of 25° C. and a relative humidity of 60% satisfy a relationship of T1>T2; and (3) applications thereof.

A photopolymerisable relief precursor includes a dimensionally stable carrier, and a photopolymerisable relief-forming layer at least containing a crosslinkable elastomeric binder, an ethylenically unsaturated monomer, a migration-capable, surface-active additive, a photoinitiator activatable with UVA light and a photoinitiator activatable with UVC light. A method for producing a relief structure.

Provided is a method for purifying an alkylene glycol monoalkyl ether carboxylic acid ester (AGAECE) for photoresist processing, wherein the method comprises the step of distillation after passing industrial AGAECE through a porous adsorbent impregnated with a basic material, and it is possible to obtain a semiconductor-grade high-purity AGAECE maintaining a low acid value and high purity according to the present invention.

A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.

A photosensitive resin composition including a silsesquioxane-based copolymer obtained by copolymerizing a first monomer represented by Chemical Formula 1 (R.sub.1—R.sub.2—Si (R.sub.3).sub.3), a second monomer represented by Chemical Formula 2 ((R.sub.4).sub.n—Si(R.sub.5).sub.4-n), a third monomer represented by Chemical Formula 3 (Si(R.sub.6).sub.4), and a fourth monomer represented by Chemical Formula 4 ((R.sub.7).sub.3—Si—R.sub.8—Si—(R.sub.7).sub.3) are provided.