Provided are a photosensitive composition including a coloring material, a resin, a polymerizable compound, a photopolymerization initiator, and a solvent A, in which the solvent A includes a solvent A1 in which a surface tension at 25° C. is 28.0 mN/m or more, a viscosity at 25° C. is 5.0 mP.Math.s or less, and a boiling point is 160° C. or higher, and a content of the solvent A1 in a total amount of the solvent A is 15% by mass or more; a method for forming a pixel formed of the photosensitive composition; a method for manufacturing an optical filter; a method for manufacturing a solid-state imaging element; and a method for manufacturing an image display device.

There are provided a manufacturing method for a substrate having a conductive pattern, a manufacturing method for an electronic device, and a substrate having a conductive pattern, which are excellent in the dimensional stability of the conductive pattern after applying an electric current, as well as a protective film for a metal nanobody.

Provided are the manufacturing method for a substrate having a conductive pattern, comprising a step 1a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 1b of forming a resin layer b containing a resin 2 on the conductive layer a; a step 2a of forming a photosensitive resin layer c on the resin layer b; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5a of softening or swelling at least one of the resin 1 or the resin 2, the manufacturing method for an electronic device, the substrate having a conductive pattern, and the protective film for a metal nanobody.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film, a backlight unit and a display apparatus manufactured using the same.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film manufactured using the same, a backlight unit and a display apparatus.

The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

A photosensitive resin composition is provided. The photosensitive resin composition is applied in a technical field of flexible display devices. The photosensitive resin composition comprises 5 to 50 parts by weight of an acrylate crosslink monomer, 0.2 to 0.6 parts by weight of an initiator, 5 to 8 parts by weight of a liquid pigment solid substance, 5 to 8 parts by weight of a resin, and 20 to 70 parts by weight of a solvent. The initiator is a radical initiator having a decomposition temperature less than 40° C. The acrylate crosslink monomer comprises a copolymerization two of aromatic group-containing and triol-containing acrylate polymerizable monomers for lowering a temperature of a following color filter preparing process. A method of preparing the photosensitive resin composition and a display device comprising the photosensitive resin composition are also provided.

The present invention provides a curable compound including a pigment, a compound A, a photopolymerization initiator, a curable compound other than the compound A, and a resin, in which a content of the compound A in a total solid content of the curable composition is 1 to 15 mass %. The compound A is a compound having each of a coloring agent partial structure, an acid group or a basic group, and a curable group. The present invention further provides a method for producing the curable composition, a film formed of the curable composition, a color filter, a method for manufacturing a color filter, a solid-state imaging element, and an image display device.

The present disclosure provides mixtures, systems, and methods for printing a three-dimensional (3D) object. In some aspects, the present disclosure provides a mixture for printing a 3D object, comprising a plurality of granulated particles. In some aspects, the present disclosure provides a mixture for printing a 3D object, comprising a plurality of precursor compounds configured to react to form a plurality of particles.