Patent classifications
G03F7/038
RESIN COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
Provided are a resin composition including a coloring material, a resin, and a solvent, in which the resin includes a resin having a structure represented by Formula (1); a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (1), Z.sup.1 represents an (m+n)-valent linking group, Y.sup.1 and Y.sup.2 each independently represent a single bond or a divalent linking group, A.sup.1 represents a group including a coloring material adsorption portion, P.sup.1 represents a polymer chain, n represents 1 to 20, m represents 1 to 20, and m+n represents 2 to 21, and in a case where m is 1, the polymer chain represented by P.sup.1 includes a repeating unit having an oxetane group, and in a case where m is 2 or more, at least one polymer chain of m pieces of polymer chains represented by P.sup.1 includes a repeating unit having an oxetane group.
[A.sup.1-Y.sup.1.sub.nZ.sup.1
Y.sup.2-P.sup.1].sub.m (1)
PHOTOSENSITIVE MATERIAL, TRANSFER FILM, MANUFACTURING METHOD OF CIRCUIT WIRING, MANUFACTURING METHOD OF TOUCH PANEL, AND PATTERN FORMING METHOD
The present invention provides a photosensitive material with which a film having a low relative permittivity can be formed. In addition, the present invention provides a pattern forming method, a manufacturing method of a circuit wiring, a manufacturing method of a touch panel, and a transfer film, which are related to the photosensitive material.
The photosensitive material of the present invention satisfies at least one requirement of the following requirement (V01) or the following requirement (W01).
(V01) the photosensitive material includes a polymer A having a carboxy group and a compound β which has a structure b0 in which an amount of the carboxy group included in the polymer A is reduced by exposure.
(W01) the photosensitive material includes a polymer Ab0 which is the polymer A and further has the structure b0 in which the amount of the carboxy group included in the polymer A is reduced by exposure.
NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY
A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight percent of a total weight of the negative tone photoresist.
NEGATIVE TONE PHOTORESIST FOR EUV LITHOGRAPHY
A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight percent of a total weight of the negative tone photoresist.
BINDER RESIN, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND DISPLAY DEVICE COMPRISING BLACK BANK FORMED USING SAME
The present application relates to a binder resin including a compound represented by Formula 1-1 and a compound represented by the following Formula 1-2, a negative-type photosensitive resin composition, and a display device including a black bank formed by using the same.
Chemically-amplified-type negative-type photoresist composition
The present invention relates to a chemically-amplified-type negative photoresist composition, and more particularly to a chemically-amplified-type negative photoresist composition suitable for use in a semiconductor process, which includes a specific organic acid additive, thereby improving a processing margin in a short-wavelength exposure light source compared to conventional negative photoresists.
Pattern-forming composition, film, infrared cut filter, infrared transmitting filter, solid image pickup element, infrared sensor, and camera module
Provided is a pattern-forming composition, including: an infrared absorbing colorant; and at least one compound selected from the group consisting of a resin having a glass transition temperature of 150° C. to 300° C. and a precursor of a resin having a glass transition temperature of 150° C. to 300° C.
Pattern-forming composition, film, infrared cut filter, infrared transmitting filter, solid image pickup element, infrared sensor, and camera module
Provided is a pattern-forming composition, including: an infrared absorbing colorant; and at least one compound selected from the group consisting of a resin having a glass transition temperature of 150° C. to 300° C. and a precursor of a resin having a glass transition temperature of 150° C. to 300° C.
Multifunctional polymers
A negative-tone resist composition is provided that contains a free photoacid generator and a multifunctional polymer covalently bound to a photoacid-generating moiety, where the composition is substantially free of cross-linking agents. Multifunctional polymers useful in conjunction with the resist composition are also provided, as is a process for generating a resist image on a substrate using the present compositions and polymers.
Resin, resist composition and method for producing resist pattern
Disclosed is a resin including a structural unit represented by formula (I) and a structural unit represented by formula (a2-A), and a resist composition: ##STR00001## wherein R.sup.1 represents a hydrogen atom or a methyl group; L.sup.1 and L.sup.2 each represent —O— or —S—; s1 represents an integer of 1 to 3; s2 represents an integer of 0 to 3; R.sup.a50 represents a hydrogen atom, a halogen atom, or an alkyl group which may have a halogen atom; R.sup.a51 represents a halogen atom, a hydroxy group, an alkyl group, an alkoxy group, an alkylcarbonyl group or the like; A.sup.a50 represents a single bond or *—X.sup.a51-(A.sup.a52-X.sup.a52).sub.nb—; A.sup.a52 represents an alkanediyl group; X.sup.a51 and X.sup.a52 each represent —O—, —CO—O— or —O—CO—; nb represents 0 or 1; and mb represents an integer of 0 to 4.