Patent classifications
G03F7/2002
Treatment liquid, method of manufacturing treatment liquid, pattern forming method, and method of manufacturing electronic device
An object of the present invention is to provide a treatment liquid for manufacturing a semiconductor with which the occurrence of defects is suppressed such that a fine resist pattern or a fine semiconductor element can be manufactured. A treatment liquid for manufacturing a semiconductor according to an embodiment of the present invention includes: one compound (A) or two or more compounds (A) that satisfy the following requirement (a); one compound (B) or two or more compounds (B) that satisfy the following requirement (b); and one compound (C) or two or more compounds (C) selected from the group consisting of an Al compound and an NOx compound. In the treatment liquid, a total content of the compound (A) in the treatment liquid is 70.0 to 99.9999999 mass %, a total content of the compounds (B) is 10.sup.−10 to 0.1 mass %, and a ratio P of the compound (C) to the compound (B) represented by the following Expression I is 10.sup.3 to 10.sup.−6. Requirement (a): a compound that is selected from the group consisting of an amide compound, an imide compound, and a sulfoxide compound and of which a content in the treatment liquid is 5.0 to 99.9999999 mass % Requirement (b): a compound that is selected from the group consisting of an amide compound having 6 or more carbon atoms, an imide compound, and a sulfoxide compound and of which a content in the treatment liquid is 10.sup.−1 to 0.1 mass %
P=[Total Mass of Compound (C)]/[Total Mass of Compound (B)] (Expression I)
Chemical Composition for Tri-Layer Removal
A method includes forming a tri-layer. The tri-layer includes a bottom layer; a middle layer over the bottom layer; and a top layer over the middle layer. The top layer includes a photo resist. The method further includes removing the top layer; and removing the middle layer using a chemical solution. The chemical solution is free from potassium hydroxide (KOH), and includes at least one of a quaternary ammonium hydroxide and a quaternary ammonium fluoride.
RADIATION SENSITIVE COMPOSITION
A compound of Formula (5-1) or Formula (5-3):
##STR00001##
where R.sup.17 and R.sup.21 are each an ethyl group; R.sup.22 and R.sup.23 are each a methyl group; and R.sup.16 and R.sup.20 are each a methoxy group.
METHOD FOR FORMING A PATTERN
In one exemplary embodiment, a method for forming a pattern includes (a) forming, on a substrate, a first pattern having an opening and containing a first material, (b) forming a filling portion in the opening, the filling portion containing a second material different from the first material, and (c) removing the first pattern so that the filling portion remains as a second pattern inverted with respect to the first pattern. At least one of the first material or the second material contains tin.
Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, patterning process, and polymer
A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1) as a repeating unit, and an organic solvent. Each of AR1 and AR2 represents a benzene ring or naphthalene ring which optionally have a substituent; W.sub.1 represents a particular partial structure having a triple bond, and the polymer optionally contains two or more kinds of W.sub.1; and W.sub.2 represents a divalent organic group having 6 to 80 carbon atoms and at least one aromatic ring. This invention provides: a polymer curable even under film formation conditions in an inert gas and capable of forming an organic film which has not only excellent heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also favorable film formability onto a substrate with less sublimation product; and a composition for forming an organic film, containing the polymer. ##STR00001##
Overlay pattern
An overlay pattern includes a light-transmitting region and a first light-proof region. The first light-proof region and the light-transmitting region are arranged on a same plane, and an area of the first light-proof region is larger than an area of the light-transmitting region. An orthographic projection of the first light-proof region on the plane and an orthographic projection of the light-transmitting region on the plane do not overlap and form a first rectangular region.
LIGHT IRRADIATION DEVICE, AND EXPOSURE APPARATUS PROVIDED THEREWITH
A light irradiation device for an exposure apparatus allowing implementation of photo-alignment process with a simple configuration is provided. The light irradiation device is configured using a light source with a plurality of LEDs, and a polarizing element that receives light from the light source and applies the light transmitted through the polarizing element to a workpiece. An optical axis of each of the LEDs is set in such a manner as to have a first angle θ1 to the workpiece. A second angle θ2 as an angle half of a light distribution angle of the light emitted from each of the LEDs is set smaller than the first angle θ1.
Mask orientation
A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks are positioned in a second plane, the plurality of masks in the mask layout have edges that each extend parallel to the first plane and parallel or perpendicular to an alignment feature on the substrate, the substrate includes a plurality of areas configured to be patterned by energy directed through the masks arranged in the mask layout. The method further includes directing energy towards the plurality of areas through the plurality of masks arranged in the mask layout over the substrate to form a plurality of patterned features in each of the plurality of areas.
PELLICLE FOR FLAT PANEL DISPLAY PHOTOMASK
A pellicle assembly for large-size photomasks including a frame member configured to be affixed to a large-size photomask substrate, a substantially rigid and transparent pellicle membrane affixed to the frame member so as to protect at least a portion of the large-size photomask substrate from contamination during usage, storage and/or transport, and a coating on at least one of top and bottom surfaces of the pellicle membrane that binds the pellicle membrane to prevent separation of pellicle membrane material in the event of breakage.
LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF USE
IR-sensitive lithographic printing plate precursors provide a stable print-out image using a unique IR radiation-sensitive composition in an infrared radiation-sensitive image-recording layer. This IR radiation-sensitive composition includes: (1) a free radical initiator composition that comprises an electron-donating agent; (2) a free radically polymerizable composition; and (3) a color-changing compound that is represented by the Structure (I) having an indene ring in the conjugated chain between the aromatic terminal groups. The compound can also have a —C(═O)—OR.sup.7, —SO.sub.2—R.sup.3, or —SO.sub.2NR.sup.8R.sup.9 group wherein R.sup.7 represents a substituted or unsubstituted alkyl group having a secondary or tertiary connecting carbon that connects to the rest of the —C(═O)—OR.sup.7 group; and R.sup.8, R.sup.9, and R.sup.10 independently represent substituted or unsubstituted alkyl, aryl, or heteroaryl groups. After IR imaging, these precursors exhibit desirable printout images both fresh and after dark storage. The precursors can be developed off-press or on-press.