A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 μm.

A method for cleaning an edge of a semiconductor wafer in a wafer edge exposure (WEE) apparatus includes positioning the semiconductor wafer having a resist thereon in a wafer positioning device. A brush bar is positioned adjacent a backside of the semiconductor wafer in the wafer positioning device. The brush bar engages and cleans a backside of the semiconductor wafer while the semiconductor wafer is disposed in the wafer positioning device. A height of an edge of the semiconductor wafer is detected. The focusing position of exposure light radiated toward the edge is controlled on the basis of a height of the edge. Exposure light is radiated towards an edge after the cleaning step.

In one embodiment, a method of fabricating a device having at least two features of differing heights comprises: depositing a resist over a substrate; determining a topography pattern for the at least two features of the device; determining an exposure pattern for the at least two features of the device; exposing a first area of the resist with a first dose of light, the first area corresponding to a first feature of the at least two features; exposing a second area of the resist with a second dose of light that is different from the first dose of light, the second area corresponding to a second feature of the at least two features; and developing the resist.

A fine metal mask includes a plate including a first and a second surfaces. The first surface has a first inner edge defining a first opening. The second surface has a second inner edge defining a second opening communicated with the first opening. The plate includes a first and a second curved surfaces respectively connecting the first surface inside the first opening and the second surface inside the second opening. The first and the second curved surfaces connect with a third inner edge defining a third opening smaller than the first and the second openings. The third inner edge includes a first straight edge, a second straight edge and a circular edge. The first and the second straight edges form an included angle. The circular edge has a radius smaller than or equal to 15 microns and connects between the first and the second straight edges.

A conductive polymer composition containing: (A) a polyaniline-based conductive polymer having a repeating unit represented by following general formula (1); and (B) polymer having structure represented by following general formula (2). In formulae, each of R.sup.1 to R.sup.4 represents hydrogen atom, acidic group, hydroxy group, alkoxy group, carboxy group, nitro group, halogen atom, or hydrocarbon group, R.sup.5 and R.sup.6 each independently represent a hydrogen atom, linear, branched, or cyclic alkyl group having 1-10 carbon atoms or a hydrocarbon group containing a hetero atom, X.sup.a- represents anion, and “a” represents valence. An object of the invention provides a conductive polymer composition which has good filterability and film-formability of flat film on electron beam resist and can be used suitably for antistatic film for electron beam resist writing showing excellent antistatic property in electron beam writing process, and, reducing effect of acid diffused from film to minimum, and also having excellent peelability.

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Described herein are technologies to facilitate device fabrication, especially those that involve spin coatings of a substrate. More particularly, technologies described herein facilitate the planarization (i.e., flatness) of spin coatings during the device fabrication to form a uniformly planar film or layer on the substrate. This abstract itself is not intended to limit the scope of this patent. The scope of the present invention is pointed out in the appending claims.

A method for fabricating a metallic wire mesh touch sensor with reduced visibility. A metallic wire mesh is formed on a transparent substrate such that the surface of the metallic wires is roughened or textured, so as to cause high scattering of incident light, thereby minimizing specularly reflected light towards the user. The metal lines are formed over patterned catalytic photoresist. The rough or textured surface of the metallic wires is achieved by roughening or texturing the catalytic photoresist, by selecting parameters of electronless plating of copper, or both. An RMS surface roughness of about 50 nm would scatter approximately 70% of incident cyan light incident at 30°.

An edge exposure apparatus includes: an imaging unit that images a front surface of a substrate; a substrate holding unit; an exposure unit that exposes an edge portion of the substrate held on the substrate holding unit; a first moving mechanism that moves and rotates the substrate holding unit; a second moving mechanism that moves the exposure unit; and a control unit that controls the first moving mechanism and the second moving mechanism, wherein the first moving mechanism and the second moving mechanism are controlled so as to acquire array information of shots of a pattern on the substrate from a substrate image of a substrate, which has already been subjected to pattern exposure, imaged by the imaging unit, and expose the edge portion of the substrate, based on the acquired array information.

A system and a method of producing sub-millimeter scale particles are provided herein. The method includes providing a substrate that has a layer of photosensitive material thereon; exposing a portion of the layer to a structured beam of light that has a cross-sectional shape, and a cross-sectional size. The cross-sectional size of the structured beam of light at the layer of photosensitive material is smaller than a sub-millimeter scale particle. The method also includes moving the substrate or the beam of light relative to each other to follow a path for making additional exposures or continuous exposure to result in a discrete exposed pattern in the layer that corresponds to the particle being produced, and exposing the layer to the light; and processing the layer to remove unexposed material around the discrete exposed pattern and to separate the discrete exposed pattern from the layer to provide the sub-millimeter scale particle.

An electrowetting display device includes a first support plate and a second support plate. A first fluid and a second fluid that is immiscible with the first fluid are between the first support plate and the second support plate. A plurality of pixel walls having concave side surfaces are formed on the first support plate to define a plurality of electrowetting pixels. A pixel electrode is disposed on the first support plate for applying a voltage within each electrowetting pixel to cause relative displacement of the first fluid and the second fluid.