Apparatus and method for exposing a printing plate having a photosensitive polymer to curing radiation. A plurality of light-emitting diodes (LEDs) are arranged in an array of columns and rows, including at least two, and more preferably at least three, different species, each species having a different center emission wavelength, preferably in the UV spectrum. The LEDs species are disposed adjacent one another in a repeating sequence. A controller connected to the array is configured to activate the array and to independently control each of the species to cause them to emit radiation towards the printing plate simultaneously with emissions patterns of adjacent members overlapping one another on the plate. A linear or planar source may comprise a plurality of independently controllable arrays.

Described herein are an apparatus and a method for direct engraving an elastomeric printing plate by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate in both the transverse and longitudinal directions.

Described herein are an apparatus and a method for direct engraving an elastomeric printing plate by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate in both the transverse and longitudinal directions.

A source of actinic radiation for curing printing plates. The source includes a base with a heat sink and has a length greater than its width. One or more circuit boards mounted on the base provide a plurality of light emitting diodes (LEDs) distributed over the length of the base. A transparent or translucent cover together with the base defines an enclosure for the plurality of LEDs. The source provides the radiation at an emission angle greater than the emission angles of a single LED in a plane perpendicular to the axis of the base, in a plane containing the axis of the base or parallel to the axis of the base and perpendicular to the target illumination plane, or a combination thereof. The source may be configured to replace a fluorescent bulb. Methods and systems for bank exposure of printing plates using such sources are also described.

Apparatus, method, and system for exposing a photosensitive printing plate to radiation, including a plurality of LED point sources configured to emit UV light. The plurality of LED point sources in at least one of a front side set or back side set are controllable in subsets smaller than an entirety of the collective irradiation field corresponding to the respective set. A holder receives the printing plate in a stationary position to receive incident radiation and a controller is configured to control the plurality of LED source subsets. A first LED point source subset is configured to be controlled at a first intensity differing by a factor relative to a second intensity of a second LED point source subset to give the radiation emitted by the respective set an intended degree of homogeneity.

Apparatus, method, and system for exposing a photosensitive printing plate to radiation, including a plurality of LED point sources configured to emit UV light. The plurality of LED point sources in at least one of a front side set or back side set are controllable in subsets smaller than an entirety of the collective irradiation field corresponding to the respective set. A holder receives the printing plate in a stationary position to receive incident radiation and a controller is configured to control the plurality of LED source subsets. A first LED point source subset is configured to be controlled at a first intensity differing by a factor relative to a second intensity of a second LED point source subset to give the radiation emitted by the respective set an intended degree of homogeneity.

Methods of micro- and nano-patterning substrates to form transparent conductive electrode structures or polarizers by continuous near-field optical nanolithography methods using a roll-type photomask or phase-shift mask are provided. In such methods, a near-field optical nanolithography technique uses a phase-shift or photo-mask roller that comprises a rigid patterned externally exposed surface that transfers a pattern to an underlying substrate. The roller device may have an internally disposed radiation source that generates radiation that passes through the rigid patterned surface to the substrate during the patterning process. Sub-wavelength resolution is achieved using near-field exposure of photoresist material through the cylindrical rigid phase-mask, allowing dynamic and high throughput continuous patterning.

Methods of micro- and nano-patterning substrates to form transparent conductive electrode structures or polarizers by continuous near-field optical nanolithography methods using a roll-type photomask or phase-shift mask are provided. In such methods, a near-field optical nanolithography technique uses a phase-shift or photo-mask roller that comprises a rigid patterned externally exposed surface that transfers a pattern to an underlying substrate. The roller device may have an internally disposed radiation source that generates radiation that passes through the rigid patterned surface to the substrate during the patterning process. Sub-wavelength resolution is achieved using near-field exposure of photoresist material through the cylindrical rigid phase-mask, allowing dynamic and high throughput continuous patterning.

A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state. A processing system for sequentially conveying a long, flexible sheet substrate along a length direction to each of a first through a third processing device to form a predetermined pattern on the sheet substrate, wherein the first through the third processing devices implement a predetermined process relating to the sheet substrate according to setting conditions set to each processing device, and when at least one from among the states of the actual processing implemented on the sheet substrate by each of the first through the third processing devices exhibits a processing error relative to a target processing state, changes other setting conditions, separate from the setting conditions exhibiting the processing error, according to the processing error.

A processing system and a device manufacturing method that can perform manufacturing of an electronic device without stopping the entire manufacturing system, even when the processing state actually implemented on a sheet substrate by a processing device differs from the target processing state. A processing system for sequentially conveying a long, flexible sheet substrate along a length direction to each of a first through a third processing device to form a predetermined pattern on the sheet substrate, wherein the first through the third processing devices implement a predetermined process relating to the sheet substrate according to setting conditions set to each processing device, and when at least one from among the states of the actual processing implemented on the sheet substrate by each of the first through the third processing devices exhibits a processing error relative to a target processing state, changes other setting conditions, separate from the setting conditions exhibiting the processing error, according to the processing error.