A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.

A circuit device includes an A/D conversion section adapted to perform an A/D conversion of a temperature detection voltage from a temperature sensor to output temperature detection data, a processing section adapted to perform a temperature compensation process of an oscillation frequency based on the temperature detection data to output frequency control data of the oscillation frequency, and an oscillation signal generation circuit adapted to generate an oscillation signal using the frequency control data and a resonator. The processing section may change the frequency control data in increments of kLSB (k1) based on a change in temperature.

A semiconductor switch control device includes a first FET and a second FET arranged adjacent to each other, in which source terminals are connected in series. A drain terminal of the first FET is connected to a high voltage battery, and a drain terminal of the second FET is connected to a high voltage load. A controller determines a temperature state of a minus-side main relay including the second FET based on a forward voltage of a body diode of the first FET.

A semiconductor switch control device includes a first FET and a second FET arranged adjacent to each other, in which source terminals are connected in series. A drain terminal of the first FET is connected to a high voltage battery, and a drain terminal of the second FET is connected to a high voltage load. A controller determines a temperature state of a minus-side main relay including the second FET based on a forward voltage of a body diode of the first FET.

In one example embodiment of a hydronic heating system, the system includes at least one condensing boiler and at least one non-condensing boiler, and at least one controller configured for utilizing at least one PID control program to generate at least one signal for controlling firing rates of one or more of the boilers based upon sensed water temperature and temperature setpoint inputs. Depending upon the mode of operation, the at least one PID control program is a first PID control program dedicated to controlling only the at least one condensing boiler, or is a second PID control program dedicated to controlling only the at least one non-condensing boiler, or includes both the first and second PID control programs. Also, outside air temperature serves as a basis for generating the temperature setpoint inputs.

Technologies for performing speculative decompression include a managed node to decode a variable size code at a present position in compressed data with a deterministic decoder and concurrently perform speculative decodes over a range of subsequent positions in the compressed data, determine the position of the next code, determine whether the position of the next code is within the range, and output, in response to a determination that the position of the next code is within the range, a symbol associated with the deterministically decoded code and another symbol associated with a speculatively decoded code at the position of the next code.

A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based of whether at least one of the first and second oxide layers breaks down.

A wireless charging control method, includes: acquiring a temperature of a wireless charging transmitter and a temperature of a charging terminal; generating a temperature adjustment instruction based on the temperature of the wireless charging transmitter and the temperature of the charging terminal; and according to the temperature adjustment instruction, controlling the temperature adjustment component in the wireless charging transmitter to adjust temperatures, so that the temperature of the wireless charging transmitter and the temperature of the charging terminal are within a set temperature range.

A wireless charging control method, includes: acquiring a temperature of a wireless charging transmitter and a temperature of a charging terminal; generating a temperature adjustment instruction based on the temperature of the wireless charging transmitter and the temperature of the charging terminal; and according to the temperature adjustment instruction, controlling the temperature adjustment component in the wireless charging transmitter to adjust temperatures, so that the temperature of the wireless charging transmitter and the temperature of the charging terminal are within a set temperature range.

An aircraft water supply system supplies water to a water discharge port in an aircraft. A cold water flow path supplies cold water to the water discharge port. A hot water flow path supplies hot water to the water discharge port. A first control valve adjusts the flow rate of cold water flowing through the cold water flow path. A second control valve adjusts the flow rate of hot water flowing through the hot water flow path. A temperature sensor detects the water temperature at any point up to the water discharge port. A flow control unit controls the opening/closing state of the first control valve and the second control valve based on the water temperature detected by the temperature sensor.