In exemplary aspects of optimizing data centers, historical data corresponding to a data center is collected. The data center includes a plurality of systems. A data center representation is generated. The data center representation can be one or more of a schematic and a collection of data from among the historical data. The data center representation is encoded into a neural network model. The neural network model is trained using at least a portion of the historical data. The trained model is deployed using a first set of inputs, causing the model to generate one or more output values for managing or optimizing the data center with respect to design and risk aspects.

An information handling system includes a corrosion controller that may monitor a corrosion sensor array, and determine a type of the corrosion based on a location of a corrosion sensor. The corrosion type may include humidity driven corrosion and non-humidity driven corrosion.

A memory module assisting in efficient heat dissipation includes a motherboard, a plurality of fixing devices, a plurality of memory cards, and a plurality of dummy memory cards. The fixing devices are fixed on the motherboard side by side. The memory cards are fixed on some of the fixing devices as necessary, and the dummy memory cards are fixed on the remaining fixing devices which are vacant. The dummy memory cards inserted into the vacant fixing devices prevent the flow of air through the space above the vacant fixing devices. An electronic device including the memory module is also disclosed.

A memory module assisting in efficient heat dissipation includes a motherboard, a plurality of fixing devices, a plurality of memory cards, and a plurality of dummy memory cards. The fixing devices are fixed on the motherboard side by side. The memory cards are fixed on some of the fixing devices as necessary, and the dummy memory cards are fixed on the remaining fixing devices which are vacant. The dummy memory cards inserted into the vacant fixing devices prevent the flow of air through the space above the vacant fixing devices. An electronic device including the memory module is also disclosed.

An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.

One aspect is directed to a system for controlling airflow in a facility having a ceiling-ducted aisle airflow containment system having a first damper system for controlling airflow. The system includes an input to receive parameters related to airflow in the facility, wherein the parameters include at least one airflow resistance value for a device in the facility, an output to provide output data including at least one setting for one or more controllable devices in the facility, and one or more processors configured to receive the parameters related to airflow, determine airflow values associated with the airflow containment system and based on the airflow values, generate the at least one setting for the one or more controllable devices, including at least one setting for the first damper system.

An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.

The present application discloses a flow guide cover and a server having the same. The flow guide cover includes an annular frame, a flow directing member, an air collecting ring, a plurality of first air guide vanes and a plurality of second air guide vanes. The flow directing member is arranged inside the annular frame and comprises a first surface and a second surface which are arranged opposite to each other, the first surface having an area greater than that of the second surface. The air collecting ring is arranged surrounding an outer periphery of the flow directing member, located between the flow directing member and the annular frame, and spaced apart from the flow directing member and the annular frame respectively. When the flow guide cover of the present application is used in conjunction with a fan, heat can be dissipated more evenly.

A system for cooling computer hardware includes a first heat exchanger and a pump. The first heat exchanger includes a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side. The first heat exchanger also includes a liquid chamber having a pump interface with at least one chamber inlet and at least one chamber outlet. The pump includes a chamber interface with at least one pump outlet and at least one pump inlet. The pump is configured to: detachably connect at the chamber interface to the pump interface, and drive the cooling liquid from a second heat exchanger to the at least one pump outlet and from the at least one a pump inlet to the second heat exchanger.