A system for cooling computer hardware includes a first heat exchanger and a pump. The first heat exchanger includes a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side. The first heat exchanger also includes a liquid chamber having a pump interface with at least one chamber inlet and at least one chamber outlet. The pump includes a chamber interface with at least one pump outlet and at least one pump inlet. The pump is configured to: detachably connect at the chamber interface to the pump interface, and drive the cooling liquid from a second heat exchanger to the at least one pump outlet and from the at least one a pump inlet to the second heat exchanger.

A cooling mechanism apparatus, system, and method for adaptively controlling heat of a vehicle processor, includes a processor configured to control deactivation or activation of an application driving the in-vehicle controller depending on grades of a predetermined functional safety level of the application and to determine an order of the deactivation or the activation of the application when heat is generated in the controller.

A system for cooling computer hardware includes a heat exchanger having a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side, the second side being opposite to the first side. The system also includes a bracket configured to removably clamp the heat exchangerto the computer hardware.

A system for cooling computer hardware includes a heat exchanger having a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side, the second side being opposite to the first side. The system also includes a bracket configured to removably clamp the heat exchangerto the computer hardware.

In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may determine first thermal attribute values associated with multiple information handling systems (IHSs) with respect to a period of time as the IHSs execute a first workload; determine multiple variance ranges respectively associated with the first thermal attributes; periodically determine second thermal attribute values associated with the IHSs as the IHSs execute a second workload; determine that a thermal attribute value of the second thermal attribute values exceeds a respective variance range of the variance ranges as a first information handling system (IHS) of the IHSs executes the second workload; generate an alert based at least on the thermal attribute value exceeding the respective variance range; and in response to the alert, transfer at least a portion of the second workload from the first IHS to a second IHS of the IHSs.

A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

A power management controller is disclosed. Broadly speaking, the controller may, in response to receiving a timing signal, monitor a temperature of an integrated circuit including multiple processor clusters. The controller may generate a comparison of the temperature and a threshold value, and in response to a determination that the comparison indicates that the temperature is less than the threshold value, transition a particular processor cluster to a new power state.