Methods and systems for timing analysis and optimization of asynchronous circuit designs are disclosed. Registration stages are placed between combinational logic circuits. For timing purposes, the registration stages are modified to have a duplicate set of pins. New paths are formed in the circuit for the purposes of timing analysis. The paths are analyzable by timing tools. Once the timing analysis is complete, the paths are reverted to original paths, and new devices are selected for the circuit design based on results of the timing analysis. An updated design is sent for manufacture, based on the timing analysis and optimization of the asynchronous circuit.

A model-building method and a model-building system for executing the method are disclosed. The method includes the following steps: reading a first netlist; extracting a netlist between an input and an initial-stage clock multi-vibrator and extracting a netlist between a final-stage clock multi-vibrator and an output from the first netlist; extracting a netlist between the input and the output from the first netlist; extracting a netlist between a first clock multi-vibrator and a second clock multi-vibrator from the first netlist; extracting netlists between the first clock input and the initial-stage clock multi-vibrator and the first clock multi-vibrator from the first netlist; extracting netlists between the second clock input and the final-stage clock multi-vibrator and the second clock multi-vibrator from the first netlist; and generating a second netlist based on extracted netlists.

A packaged memory device can include a primary memory die coupled to a shared intra-package communication bus and coupled to an external host device using a host interface bus, and the host interface bus can include a host clock channel. The memory device can include multiple secondary dies coupled to the intra-package communication bus, and each of the secondary dies can be configured to receive the same messages from the primary memory die using the intra-package communication bus. The primary memory die can send a first message to, or receive a first message from, a particular one of the secondary dies using the intra-package communication bus, and the first message can include a first chip identification field that exclusively indicates the particular one of the secondary dies.

A system, and corresponding method, is described for using a model to predict the physical behavior of IP from an HDL representation of the IP. The system generated data for training and testing the model by treating the logical parameters and physical parameters subset as one for the IP block. The system digitizes the non-numerical parameters and compresses timing arcs. The system uses the trained model to characteristic behavior for an IP block directly from the combined vector of logical parameter values and physical parameter values.

A system, and corresponding method, is described for using a model to predict the physical behavior of IP from an HDL representation of the IP. The system generated data for training and testing the model by treating the logical parameters and physical parameters subset as one for the IP block. The system digitizes the non-numerical parameters and compresses timing arcs. The system uses the trained model to characteristic behavior for an IP block directly from the combined vector of logical parameter values and physical parameter values.

Examples of techniques for statistical static timing analysis of an integrated circuit are disclosed. In accordance with aspects of the present disclosure, a computer-implemented method for statistical static timing analysis of an integrated circuit is provided. The method may comprise identifying a timing parameter that contributes to a delay calculation. The method may further comprise determining, by a processing device, whether the identified timing parameter significantly impacts the delay calculation. The method may also comprise, responsive to determining that the identified timing parameter does not significantly impact the delay calculation, avoiding a sensitivity calculation for the identified timing parameter.

A method as provided includes retrieving a correlation value from a correlation table and a coskewness value from a coskewness table. The correlation value includes a correlation between a delay distribution and a slew rate distribution, and is associated with both: an input slew rate and an output load, in a logic stage in an integrated circuit design, and the coskewness value is a coskewness between the delay distribution and the slew rate distribution. The method includes determining a partial derivative of a delay function relative to the input slew rate, determining a delay distribution for a signal through a plurality of logic stages using the correlation value, the coskewness value, and the partial derivative of the delay function relative to the input slew rate. The method also includes verifying that a statistical value of the delay distribution satisfies a desired performance value for an integrated circuit.

Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.

Systems and methods for application specific integrated circuit design using Chronos Links are disclosed. A Chronos Link is an ASIC on-chip and off-chip interconnect communication protocol that allows interfaces to transmit and receive information. The protocol may utilize messages or signals to indicate the availability and/or readiness of information to be exchanged between a producer and a consumer allowing the communication to be placed on hold and to be resumed seamlessly. A method includes inserting gaskets and channel repeaters connected to interfaces of multiple intellectual property (IP) blocks in order to replace traditional links with Chronos Links; performing simplified floorplanning; performing simplified placement; performing simplified clock tree synthesis (CTS) and routing; and performing simplified timing closure.

There is disclosed a self-timed processor. The self-timed processor includes trigger logic having a trigger input to receive an event trigger signal, a data input set to data value 1, a trigger output to send a trigger output signal when the event trigger signal is received, and a reset input to reset the trigger output signal. The processor also has a delay insensitive asynchronous logic (DIAL) block with multi-rail DIAL inputs to receive a multi-rail DIAL input having a) the trigger output signal, and b) data value 0; and data phase completion logic to output a completion signal indicating an end of a data propagate phase of the DIAL block to reset the trigger output signal when multi-rail data DIAL data process values of the DIAL block reach a DIAL valid state.