Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.

A cooling system can distribute fluid to and from IT equipment in an IT rack which can be understood as a server rack which houses multiple servers. The cooling system can include three distribution channels for the server rack. At least one of the distribution channels can be connected to valves that are arranged to operate that distribution channel in a bi-directional manner. This bi-directional distribution channel can switch operation if any of the other distribution channels becomes inoperative.

Disclosed herein is a computer circuit card cage system configured to house one or more computer circuit cards. The computer circuit card cage system can comprise a housing comprising one or more walls having one or more apertures formed therein. The computer circuit card cage system can further comprise one or more support rails supported on one or more of the walls and configured to support a computer circuit card. The one or more support rails can have one or more apertures formed therein to facilitate flow of a fluid through the one or more support rails. The flow path of the fluid is through the one or more apertures in the walls of the housing, and the one or more apertures in the support rails.

An information handling system includes a first set of components, a second set of components, and a hybrid cooling system. The hybrid cooling system includes a fan structure, a liquid cooling system, and a fan insert. The fan structure includes multiple cooling fans to provide air cooling to the first components of the information handling system. The liquid cooling system provides liquid cooling to one or more of the second components. The liquid cooling system includes a first liquid line routed through an empty fan cavity of the fan structure. The fan insert is located within the empty fan cavity and provides a seal against air-bypass and recirculation within the information handling system.

Systems and methods for cooling in a datacenter are disclosed. In at least one embodiment, a thermal load bank (TLB) system to test a hybrid datacenter cooling system includes one or more thermal features to generate heat within a TLB system and includes one or more hybrid cooling features to provide air and liquid cooling responses to such heat generated by one or more thermal features.

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.

An information processing apparatus includes a fan that cools a first processor, a dust-proof bezel that prevents dust from entering a casing, a memory, and a second processor coupled to the memory. The second processor is configured to measure a temperature of the first processor and an air volume of an air flow which passes through the dust-proof bezel, compare a registered air volume to the measured air volume when the temperature matches a registered temperature included in comparison information stored in the memory. The registered air volume being included in the comparison information in association with the matched temperature and the comparison information including a registered temperature of the first processor and a registered air volume of an air flow generated by the fan in association with each other. The second processor determines an abnormality in the dust-proof bezel based on a comparison result.

Obtain a putative design for a vapor chamber lid for an electronic device; iteratively: obtain a steady state solution of governing equations of the putative design, wherein the governing equations include a thermal energy equation in a solid domain of the putative design and include continuity, momentum, and energy equations in vapor and liquid/wick domains of the putative design; modify the putative design in response to a difference between the evaporator temperature of the steady state solution and a threshold value for evaporator temperature; and obtain a new steady state solution of the governing equations for the putative design; and set a final design for the vapor chamber lid when a satisfactory result is obtained for the difference between the evaporator temperature and the threshold value for evaporator temperature.