Examples of the disclosure relate to vapour chambers. Examples of the disclosure can provide an apparatus comprising: at least a first vapour chamber portion and a second vapour chamber portion wherein the vapour chamber portions comprise walls housing an internal volume where the internal volume is configured to enable vapour flow; at least one hinge formed from walls of the first vapour chamber portion and walls of the second vapour chamber portion and configured to enable the first vapour chamber portion to be moved relative to the second vapour chamber portion; and wherein the hinge is thermally conductive and configured to enable heat to be transferred from the first vapour chamber portion to the second vapour chamber portion.

A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

A server rack includes an air inlet configured to intake air from outside of the server rack, an air exhaust outlet configured to exhaust air to an outside of the server rack, an inlet temperature sensor configured to measure the temperature of inlet air, a heat exchanger provided at an air exhaust outlet of the server rack, a power consumption sensor provided to a power supply of the server rack and configured to measure electrical power consumption of the server rack, and a heat exchange controller configured to control heat exchange between the heat exchanger and the exhaust air based on measurements from the inlet temperature sensor and the power consumption sensor.

In one embodiment, a method includes, by a computing system of a vehicle, determining a first temperature of a control unit of the vehicle, wherein the control unit and one or more components of the vehicle are interconnected through a thermal network, determining a thermal objective for the control unit based on the first temperature of the control unit, selecting, based on the thermal objective for the control unit, at least a first component from the one or more components, and sending one or more signals to one or more actuators within the thermal network to enable a heat-transfer fluid to flow between (1) a first portion of the thermal network thermally coupled to the control unit and (2) a second portion of the thermal network thermally coupled to the selected first component.

A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.

A cooling system includes a first module provided with a substrate, a heat generating member, and a cooling member, a second module provided on a first side of a housing in a depth direction with respect to the first module and provided with a substrate, a heat generating member, and a cooling member, an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module, and a discharge tube configured to discharge the cooling medium passed through the first module and the second module.

An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

A flow detection device comprises a fluidic input port connected to a fluidic output port via a channel and a float located within the channel. A specific weight of the float exceeds a specific weight of a fluid injected in the flow detection device. Respective locations of the fluidic input port, of the channel and of the fluidic output port on the flow detection device cause the float to rise within the channel when a sufficient flow of the fluid is injected in the flow detection device. A sensor is provided to detect a position of the float within the channel. The flow detection device may be integrated in a cooling circuit having a cooling device for an electronic device to detect an eventual lack of a flow of a cooling fluid in the cooling circuit. A status of the flow of the cooling fluid is reported to a processor.