The present disclosure includes apparatuses and methods for compute enabled cache. An example apparatus comprises a compute component, a memory and a controller coupled to the memory. The controller configured to operate on a block select and a subrow select as metadata to a cache line to control placement of the cache line in the memory to allow for a compute enabled cache.

Examples of the present disclosure provide apparatuses and methods related to a translation lookaside buffer in memory. An example method comprises receiving a command including a virtual address from a host translating the virtual address to a physical address on volatile memory of a memory device using a translation lookaside buffer (TLB).

The present application includes apparatuses and methods for compute enabled cache. An example apparatus includes a compute component, a memory and a controller coupled to the memory. The controller configured to operate on a block select and a subrow select as metadata to a cache line to control placement of the cache line in the memory to allow for a compute enabled cache.

The present disclosure includes apparatuses and methods for compute enabled cache. An example apparatus comprises a compute component, a memory and a controller coupled to the memory. The controller configured to operate on a block select and a subrow select as metadata to a cache line to control placement of the cache line in the memory to allow for a compute enabled cache.

Examples of the present disclosure provide apparatuses and methods related to a translation lookaside buffer in memory. An example method comprises receiving a command including a virtual address from a host translating the virtual address to a physical address on volatile memory of a memory device using a translation lookaside buffer (TLB).

Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.

An apparatus includes a semiconductor fuse array, disposed on a semiconductor die, into which is programmed configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is configured to store the configuration data in an encoded and compressed format. The second plurality of semiconductor fuses is configured to store first fuse correction data that indicates locations and values corresponding to a first one or more fuses within the first plurality of fuses whose states are to be changed from that which was previously stored.

An apparatus including a plurality of cores and a fuse array. The plurality of cores is disposed on a die. The fuse array is disposed on the die and is coupled to each of the plurality of cores, where the fuse array includes a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is programmed with compressed configuration data for the each of the plurality of cores. The second plurality of semiconductor fuses is programmed with core designation data that associates some of the compressed configuration data with one of the plurality of cores, where the one of the plurality of cores accesses and decompresses the some of the compressed configuration data upon power-up/reset, for initialization of elements within the one of the plurality of cores.

An apparatus is contemplated for storing and providing configuration data to an integrated circuit device, the apparatus has a fuse array and a plurality of cores. The fuse array is disposed on a die. The fuse array has a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the fuse array. The each of the plurality of cores includes array control, configured to access the first and second pluralities of fuses, and configured to process first states of the first plurality of semiconductor fuses and second states of the second plurality of semiconductor fuses according to contents of a configuration data register.

An apparatus includes a plurality of cores and a fuse array. The plurality of cores is disposed on a die. The fuse array is disposed on the die and is coupled to each of the plurality of cores, where the fuse array includes a plurality of semiconductor fuses that are programmed with compressed configuration data for the each of the plurality of cores, and where the each of the plurality of cores accesses and decompresses all of the compressed configuration data upon power-up/reset, for initialization of elements within the each of the plurality of cores.