Processing of out-of-order data transfers is facilitated in computing environments that enable data to be directly transferred between a host bus adapter (or other adapter) and a system without first staging the data in hardware disposed between the host bus adapter and the system. An address to be used in the data transfer is determined, in real-time, by efficiently locating an entry in an address data structure that includes the address to be used in the data transfer.

The present invention relates to an electronic apparatus, which integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost. Moreover, the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit.

The present invention relates to an electronic apparatus, which lays out an I/O module and a power supply module in a case reasonably and neatly, and specifically causes the I/O module and the power supply module to be set in a first receiving space of the case with equal height and equal length, so that more modules can be laid out in a limited case space, thus having a high utilization rate and a low cost; moreover, the I/O module and the power supply module are separately designed, and the modules cooperate with each other; the modules are snap structures, and can be assembled and disassembled by hand, which increases operation and maintenance efficiency.

The present invention relates to an electronic apparatus, which integrates an adapter plate, a PCIE card and a fan into an input/output unit, communicates with other electronic elements in the electronic apparatus through the adapter plate in the input/output unit, and reasonably lays out elements in the input/output unit, so that more electronic elements can be laid out in a limited electronic apparatus case space, thus having a high utilization rate and a low cost. Moreover, the design of the internally integrated fan makes the input/output unit and the electronic apparatus have good heat dissipation effects, and the input/output unit may be designed as hot plug, facilitating replacement and maintenance of the whole input/output unit.

The present invention relates to an electronic apparatus, which includes at least two node modules; a shared I/O module, having a first I/O interface connected with an external device and a second I/O interface electrically connected with the at least two node modules; and a switching module connecting the at least two node modules and the shared I/O module, used to cause the shared I/O module to communicate with one node module in the at least two node modules through the second I/O interface according to a selection signal when receiving the selection signal. The shared I/O module integrates multiple communication ports, and can switch the node module communicating with the shared I/O module according to a selection signal, and the shared I/O module can design a shared I/O module combined by multiple different ports in advance, to perform corresponding replacement according to user needs; the present invention meets high-integration modular design of the electronic apparatus, and ensures stability and high efficiency of communications between the modules.

The present invention relates to an electronic apparatus, the back plate, the I/O module, the power supply, the node module and the like are reasonably and neatly laid out in the case, so that more modules can be laid out in a limited case space, thus having a high utilization rate and a low cost. Besides, the I/O module, the power supply module and the node module are separately designed, and the modules cooperate with each other; the modules are snap structures, and can be assembled and disassembled by hand, which increases operation and maintenance efficiency. Moreover, the completion of the signal transmission among different modules mainly depends on the golden finger or the high-speed back plate connector, thus the case is clean and neat inside.

A RAID (redundant array of independent disks) hot spare (RHS) system and method that permits a daisy-chain of interconnected pass-thru disk drive controllers (PTDDCs) each connected to a SATA local disk drive (LDD) storage element (DSE) to support a hot spare disk (HSD) such that a failing disk drive (FDD) in the RAID array can be immediately replaced by a HSD within the PTDDC daisy-chain without operator intervention is disclosed. The PTDDCs within the daisy-chain are configured in RAID fashion to support mirroring of one or more drives in the PTDDC daisy-chain. The PTDDCs monitor functional status of LDDs attached to each PTDDC. FDD failure triggers activation of a HSD in the PTDDC daisy-chain and automatic mirror copying along the PTDDC daisy-chain of RAID data from a master disk drive (MDD) mirrored to the LDD. FDD-PTDDC and HSD-PTDDC LBA mapping registers are updated after mirror copying completes.